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Polishing pad and manufacturing method thereof

A polishing pad and area technology, applied in the field of polishing pads, can solve the problems of inability to reduce metal contamination on the wafer surface, unclear concentration of metal in the polishing pad, etc., and achieve the effect of suppressing the uniformity in the plane

Inactive Publication Date: 2010-03-03
TOYO TIRE & RUBBER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0028] However, the concentration of metals in specific abrasive pads is unclear
In addition, since the mold is formed during the manufacture of the polishing pad, the metal contamination of the wafer surface cannot be reduced in this polishing pad.

Method used

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  • Polishing pad and manufacturing method thereof
  • Polishing pad and manufacturing method thereof
  • Polishing pad and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0349] 100 parts by weight of liquid acrylic urethane (Actilane 290, manufactured by AKCROS CHEMICALS) and 1 part by weight of benzyl dimethyl ketal were stirred at 800 rpm for about 3 minutes using a rotation-revolving mixer (manufactured by Shinky Company). A liquid photocurable resin composition was obtained. A release film was temporarily fixed on the surface of the produced polished region, and the polished region was placed in a mold frame. Then, the said photocurable resin composition was poured into the space part for forming an opening part and a water-permeable prevention layer. Set the mold frame temperature to 40 degrees. Thereafter, the photocurable resin composition was cured by ultraviolet irradiation to form a transparent member in which the light-transmitting region and the water-permeable preventing layer were integrally formed. The surface of the water-proof layer was polished with a grinder, and the thickness accuracy was adjusted. The thickness of the l...

Embodiment 2

[0351] A polishing pad was produced by the same method as in Example 1 except that the thickness of the water-permeable-proof layer was 0.8 mm.

Embodiment 3

[0353] By the same method as in Example 1, a transparent member in which the light-transmitting region and the water-permeable preventing layer were integrally formed was formed. Thereafter, a double-sided tape (manufactured by Sekisui Chemical Industry Co., Ltd., Doubletuck tape) was bonded to the surface of the water permeation prevention layer using a laminator. Thereafter, a buffer layer made of polyethylene foam (manufactured by Tore Corporation, TOREPEF, thickness: 0.8 mm) whose surface was polished and corona-treated was attached to the double-sided tape. In addition, the double-sided adhesive tape was pasted on the surface of the buffer layer. Thereafter, the double-sided tape and the buffer layer were removed in a size of 51 mm×13 mm at a position aligned with the light-transmitting region, thereby producing a polishing pad.

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PUM

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Abstract

It is an object of the invention to provide a polishing pad capable of high precision optical detection of an endpoint during polishing in progress and prevention of slurry leakage from between a polishing region and a light-transmitting region during the use thereof even after the polishing pad has been used for a long period. Specifically disclosed is a polishing pad which is provided with a water permeation-preventing layer (10) on one side of a polishing region (8) and a light-transmitting region (9). The light-transmitting region and the water permeation-preventing layer are formed integrally from a same material.

Description

[0001] This application is a divisional application of 2005800420558 (International Application No.: PCT / JP2005 / 022550). The filing date of the original application was December 8, 2005. The invention name of the original application is a grinding pad and a manufacturing method of a grinding pad. technical field [0002] The present invention relates to a polishing pad used when planarizing the unevenness of the surface of a polished body such as a semiconductor wafer with chemical mechanical polishing (CMP), and specifically relates to a polishing pad with a window (light transmission) for detecting the polishing condition etc. by using an optical mechanism. region) and a method of manufacturing a semiconductor device using the same. Background technique [0003] In the manufacture of semiconductor devices, the process of forming a conductive film on the surface of a semiconductor wafer (hereinafter also referred to as a wafer) and forming a wiring layer by performing photol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/04H01L21/02B24B37/013B24B37/20B24B37/22H01L21/304
Inventor 小川一幸下村哲生数野淳中井良之渡边公浩山田孝敏中森雅彦
Owner TOYO TIRE & RUBBER CO LTD