Aluminum-induced low temperature preparation method of large grain size polysilicon film
A technology of polycrystalline silicon thin film and amorphous silicon thin film is applied in the field of preparation of large-grained polycrystalline silicon thin film, which can solve the problems of poor repeatability and complicated control process, and achieve the effects of reducing preparation cost, large grain size, and smooth surface.
Inactive Publication Date: 2011-01-05
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS +1
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
The method of nickel induction can also be used to prepare large-grained polysilicon films with grains up to 100 microns. However, during the preparation process, nickel particles with a very low surface concentration must be prepared on the surface of amorphous silicon. The control process is complicated, the repeatability is poor, and it takes a long time time annealing
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
Embodiment 2
Embodiment 3
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| size | aaaaa | aaaaa |
Login to View More
Abstract
The invention discloses an aluminum-induced low temperature preparation method of large grain size polysilicon film; the grain size of the prepared polysilicon film reaches above 100 microns and the polysilicon film has smooth surface. The method comprises the following steps: (1) depositing amorphous silicon film on a substrate 2; (2) continuously generating silicon dioxide film; (3) continuously depositing aluminum film to obtain substrate / a-Si / SiO2 / Al lamination; (4) placing the substrate / a-Si / SiO2 / Al lamination in a vacuum annealing furnace to perform three-step annealing under the protection of inert atmosphere; (5) using aluminum corrosive liquid to corrode and remove the residual aluminum on the surface. The method of the invention can prepare polysilicon film with large grain sizeon the cheap substrate at low temperature and the crystallization orientation and surface roughness are controllable, thus the method has broad application prospect in fields such as film solar cellsand the like.
Description
Method for preparing large-grain polysilicon film at low temperature induced by aluminum technical field The invention relates to a method for preparing a large-grain polysilicon film, in particular to a method for rapidly preparing a large-grain polysilicon film with a grain size of 100 microns at low temperature by an aluminum induction method. Background technique Polysilicon is widely used in electronic devices, such as thin film transistors, solar cells, image sensors, etc. Solar cells made of polysilicon thin films have stable performance and low price, and have great application potential. The traditional method of preparing polysilicon film is to directly deposit it on the substrate by low-pressure chemical vapor deposition (LPCVD) and plasma-enhanced chemical reaction vapor deposition (PECVD). Directly deposited polycrystalline silicon has small grains, many defects, and poor electrical properties. The polysilicon formed by the recrystallization of amorphous sil...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/06C23C14/10C23C14/18C23C14/35C23C14/46C23C14/24C23C14/58C30B28/12
Inventor 沈鸿烈唐正霞鲁林峰漆海平江丰
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
