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Processing apparatus and vertical thermal processing apparatus

一种热处理装置、处理装置的技术，应用在运输和包装、输送机物件、电气元件等方向，能够解决难窄间距的舟皿移载操作等问题，达到增大处理片数、减小弯曲量和厚度的效果

Active Publication Date: 2010-03-10
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is difficult to carry out the transfer operation to the narrow-pitch boat

Method used

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  • Processing apparatus and vertical thermal processing apparatus
  • Processing apparatus and vertical thermal processing apparatus
  • Processing apparatus and vertical thermal processing apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings. figure 1 It is a longitudinal cross-sectional view schematically showing a vertical heat treatment apparatus as one embodiment of the present invention.

[0036] like figure 1 As shown, the longitudinal heat treatment device 1 has a housing 2 forming the outer contour. A vertical heat treatment furnace 3 for accommodating a substrate to be processed, for example, a thin disc-shaped semiconductor wafer w, and performing a predetermined process such as CVD treatment is provided above the casing 2 . This heat treatment furnace 3 is mainly composed of a vertically elongated reaction tube 5 made of, for example, quartz as a processing container whose lower part is opened as a furnace port 4, a liftable cover 6 for opening and closing the furnace port 4 of the reaction tube 5, and A heater (heating device) 7 provided to cover the periphery of the r...

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PUM

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Abstract

The present invention provides a processing apparatus and a vertical thermal processing apparatus. The vertical thermal processing apparatus is provided with a transfer mechanism having a transfer plate, the transfer mechanism being configured to cause, when a substrate to be processed is placed on an upper surface of the transfer plate, the transfer plate to move while maintaining the substrate to be processed placed horizontally thereon. The transfer plate has a cantilevered support structure horizontally extending from a proximal end thereof to a distal end thereof in a fore and aft direction. An upper surface of the transfer plate is provided with a plurality of support projections configured to horizontally support the substrate to be processed at a substantially central position thereof and a rear position thereof in the fore and aft direction. The substrate to be processed is not supported on the distal portion of the transfer plate.

Description

technical field [0001] The present invention relates to a vertical heat treatment device for performing heat treatment on a substrate to be processed. Background technique [0002] In the manufacture of semiconductor devices, various processing apparatuses (semiconductor manufacturing apparatuses) are used to perform oxidation, diffusion, CVD (Chemical Vapor Deposition) and other treatments on substrates to be processed, such as semiconductor wafers (hereinafter referred to as wafers). Furthermore, as one of various processing apparatuses, there is known a batch-type vertical heat processing apparatus capable of simultaneously performing heat treatment on a plurality of substrates to be processed. [0003] This vertical heat treatment apparatus includes: a heat treatment furnace; a substrate support tool (also referred to as a boat) that supports a plurality of wafers at predetermined intervals in the vertical direction, and is carried in and out of the heat treatment furnac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/677H01L21/683
CPCH01L21/67109H01L21/67766H01L21/68707
Inventor 浅利聪高桥喜一安部俊裕
Owner TOKYO ELECTRON LTD