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Improved mold suction structure

A technology of mold and suction area, applied in the field of mold suction structure improvement, can solve problems such as affecting production capacity and energy loss, reducing production yield, and increasing pumping time, so as to reduce energy loss, speed up suction time, The effect of reducing the suction area

Inactive Publication Date: 2010-03-17
WISTRON CORP
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The air-tight ring 2a is designed on the outermost periphery of the workpiece, and there is only one ring of air-tight ring 2a. The disadvantage is that the sealing range is too large, and it takes too long for the master mold base 1a to pump air so that the transfer film is completely vacuum-coated on the master mold. long, affecting capacity and energy loss
[0006] The position of the air hole 3a is closer to the center of the master mold base 1a, so when the adsorption area 21a is too large, the pumping time will be increased, and at the same time, due to the poor suction efficiency, the transfer film at the four corners is prone to wrinkle The folding phenomenon will further affect the next step of the process, and finally cause the appearance of the product to have creases, reducing the production yield

Method used

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Embodiment Construction

[0033] see Figure 2A As shown, the improvement of the mold suction structure of the present invention is applied in the In-Mold Decoration (IMD) process, and its structure includes: a mold base body 1, at least two sealing structures 2 and a plurality of suction holes 3, The mold base body 1 is installed in an injection molding machine (not shown), and the two sealing structures 2 and the plurality of suction holes 3 are located in the mold base body 1 .

[0034] The two sealing structures 2 are arranged in the mold base body 1 in a manner of separating the inside and the outside, and each of the two sealing structures 2 is in a closed shape, and a suction area 21 is formed between the two sealing structures 2, wherein the two sealing structures 2 The shape of the two sealing structures 2 is formed according to the shape of the object to be processed (not shown), so the shape of the two sealing structures 2 is not fixed, and it can be circular, square, or geometrically symmet...

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Abstract

The invention discloses an improved mold suction structure, which comprises a mold base body, two sealing structure, a plurality of suction holes and a plurality of suction channels, wherein the two sealing structures are arranged on the mold base at intervals and a suction area is formed between the two sealing structures; the plurality of suction holes are arranged in the suction area; and the plurality of suction channels are arranged in the suction area and connected with the plurality of suction holes. By means of the mutual matching of the suction area, the plurality of suction holes andthe plurality of suction channels, a film can be quickly and flatly adsorbed to improve the yield of In-Mold Decoration (IMD) manufacture procedure.

Description

technical field [0001] The invention relates to the improvement of the suction structure, in particular to the improvement of the mold suction structure applied to the in-mold transfer technology. Background technique [0002] With the rapid rise of the consumer market and the new generation of digital consumer electronics products, the importance of digital product appearance design is undoubted, and the casing plays a key role in product appearance. In addition to the first impression of the product to consumers , and also fundamentally changed the materials used (reduce the use of harmful substances), manufacturing methods, post-processing and processes (reduce the process) of the new generation of 3C (Computer, Communication, Consumer Electronics) product casings, among which the manufacturing method In order to make the appearance of 3C products have more visual changes and touch textures, surface treatment technologies have also undergone multiple developments in recen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C63/20
Inventor 洪俊彦谢振丰
Owner WISTRON CORP