Circuit board plating device and method
An electroplating device and circuit board technology, which is applied in the manufacture of electrical components, printed circuits, and printed circuits, can solve the problems of uneven distribution of plated hole patterns, uneven electroplating layers of circuit boards, and difficult control of electroplating current, etc. , to achieve the effect of easy control of current and uniform plating layer
Inactive Publication Date: 2010-04-21
SHENZHEN SUNTAK MULTILAYER PCB
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Problems solved by technology
[0003] The technical problem solved by the present invention is: to overcome the technical problems of uneven electroplating layer of the circuit board or difficult control of the electroplating current in the existing circuit board electroplating technology when the pattern distribution of the plated holes is uneven or the pattern of the plated holes is too sparse
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[0022] The technical solutions of the present invention will be further described below in conjunction with specific embodiments.
[0023] Such as figure 1 As shown, the specific embodiment of the present invention is: build a kind of circuit board electroplating device, comprise plated hole unit 1, the distribution of described plated hole unit 1 on circuit board is uneven, described plated hole unit 1 is unevenly distributed and includes The densely distributed area 3 of the plated hole unit 1 is different from the sparsely distributed area 4 of the plated hole unit 1 and the distribution area of the plated hole unit 1 is different in size. The dummy plating points 2 for dispersing the electroplating current are arranged around the small areas 32 distributed in 1. In this embodiment, the dummy plating points 2 for dispersing the electroplating current are set in the gaps of the plated hole units 1 in the sparsely distributed area 4 of the plated hole units 1 or around the...
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The invention relates to a circuit board plating device and a circuit board plating method. The circuit board plating device comprises hole plating units and a plating unit which is used for plating the hole plating units on the circuit board, wherein the hole plating units are distributed on the circuit board unevenly to form hole plating unit dense distribution areas and hole plating unit thin distribution areas with different sizes; and the clearances of the hole plating units in the hole plating unit thin distribution areas or the peripheries of small areas distributed with the hole plating units are provided with false plating spots for dispersing plating current. When the hole plating units are distributed on the circuit board unevenly, a plating layer is still even on the circuit board, and simultaneously the current is easy to control.
Description
technical field [0001] The invention relates to a circuit board electroplating device and an electroplating method, in particular to a circuit board electroplating device and an electroplating method for unevenly distributed plating hole patterns or excessively sparse plating hole patterns. Background technique [0002] In the existing circuit board electroplating process, it is usually necessary to partially electroplate the positions of through holes or blind holes by means of plated holes, so that the copper thickness in these through holes or blind holes can reach the required range. When plated through holes or blind holes, only the positions with holes are exposed, and the positions without holes are covered by dry film, and the current will gather at the pattern with holes. If the pattern of plated holes is unevenly distributed, more current will be concentrated to relatively isolated holes, and the current density of isolated holes will be higher than that of other h...
Claims
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Inventor 刘东
Owner SHENZHEN SUNTAK MULTILAYER PCB