Segregation apparatus and segregation method

Abstract

The invention relates to a segregation apparatus and segregation method. The segregation apparatus is used for separating an electronic body from a base board, which are bonded, and comprises a platform, a transmission part, a dissolving part, a cleaning part and a first separating board; the transmission part is configured on the platform and used for moving the electronic body and the base board; the dissolving part is configured on the platform and used for spraying a solvent on the electronic body and the base board; the cleaning part is configured on the platform and used for cleaning the electronic body; and the first separating board is arranged between the dissolving part and the cleaning part and provided with at least one first through hole for the electronic body to penetrate through only. As only the electronic body can penetrate through the first through hole while the base board can not, the electronic body and the base board are separated.

Description

technical field [0001] The invention relates to a separating device and a separating method, in particular to a separating device and a separating method for horizontally moving an electronic body and a substrate for separating and collecting automatic procedures. Background technique [0002] Generally, the cleaning method of traditional electronic bodies (such as semiconductor wafers, solar cells or panels) is to send the electronic body to the cleaning place with a robotic arm for cleaning, and then transport the electronic body to a drying place with a robotic arm to dry the liquid on the electronic body. Then the dried electronic body is sent to the storage area intact by the mechanical arm for storage. [0003] From the above, it can be seen that the previous technology has a series of operations from the preparation of cleaning and drying of the electronic body to the completion of loading in the storage area, all of which are individual independent actions and incohe...

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Problems solved by technology

[0003] From the above, it can be seen that the previous technology has a series of operations from the preparation of cleaning and drying of the electronic body to the completion of loading in the storage area, all of which are individual independent actions and incoherent. It is impossible to integrate all the processes into a continuous process, resulting in excessive time consumption. , the increase in cost and maintenance cost, and in each operation, each action only acts on a single wafer, and cannot process wafers in batches and in large quantities, resulting in a significant drop in overall efficiency

[0004] In addition, facing the thinning of the electronic body, an adhesive substrate must be added to the electronic body that will become thinner in the future to prevent damage during handling and operation. However, the existing electronic body cleaning device does not make the electronic body and the substrate separate device

[0005] It can be seen that the above-mentioned existing electronic body cleaning device obviously still has inconvenience and defects in product structure, cleaning method and use, and needs to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure and method for general products and methods to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve

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