Solid state light-emitting element and light source module
A solid-state lighting and light source module technology, which is applied to semiconductor devices, light sources, electric light sources, etc. of light-emitting elements, and can solve problems such as low heat dissipation efficiency, inability to dissipate heat in time, and poor overall heat dissipation performance of the solid-state light-emitting element 100. , to achieve the effect of reducing uneven heating and good heat dissipation performance
Inactive Publication Date: 2010-06-16
FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC +1
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Problems solved by technology
However, due to the low heat dissipation efficiency of the substrate 102 (usually made of plastic or high molecular polymer), the heat generated by the LED chip 104 cannot be dissipated in time, resulting in poor overall heat dissipation performance of the solid-state light emitting device 100. good
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[0014] The embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0015] see figure 2 , the solid-state light-emitting element 10 with good heat dissipation performance provided by the first embodiment of the present invention includes: a ceramic package 11 , a solid-state light-emitting chip 12 and a resin layer 15 .
[0016] The ceramic package 11 includes a first surface 110 and a second surface 112 surrounding the first surface 110 . The first surface 110 and the second surface 112 meet to form a receiving space 114 . A first through hole 116 is defined on the first surface 110 , and the first through hole 116 is filled with a first metal, such as copper, silver, and the like. Preferably, the first metal is silver, which can reach a thermal conductivity of 430 W / mk and has better oxidation resistance. Of course, the first metal can also be an alloy containing silver. The ceramic package body 11 c...
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The invention relates to a solid state light-emitting element with good heat dispersion, which comprises a ceramic packing body and at least one solid state light-emitting chip, wherein the ceramic packing body is provided with a first surface, and the at least one solid state light-emitting chip is jointed with the ceramic packing body through the first surface; at least one first through hole is formed on the ceramic packing body, one end of the at least one first through hole penetrates through the first surface, and a first metal which is in thermal contact with the at least one solid state light-emitting chip is filled in the at least one first through hole; and the ceramic packing body comprises an aluminum oxide composite material containing silicon oxide. In addition, the invention also relates to a light source module comprising the solid state light-emitting element.
Description
technical field [0001] The invention relates to a solid-state light-emitting element and a light source module containing the solid-state light-emitting element. Background technique [0002] Light Emitting Diode (Light Emitting Diode, LED) is a solid-state light-emitting element, and its electrical and optical characteristics and life are sensitive to temperature. Here, a new type of light-emitting diode that can maintain a stable light intensity during temperature changes can be found in YukioTanaka et al. A Novel Temperature-Stable Light-Emitting Diode in the document IEEE Transactions On Electron Devices, Vol.41, No.7, July 1994. Generally, higher temperature will lead to lower internal quantum effects and significantly shorten the lifetime; and the resistance of semiconductors will decrease with the increase of temperature, and the sliding resistance will bring larger current and more heat generation, Cause heat accumulation; this heat damage cycle tends to accelerate ...
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IPC IPC(8): H01L33/00H01L25/075H01L23/36H01L23/367H01L23/373F21S2/00F21V29/00F21V19/00F21Y101/02
CPCH01L33/642H01L33/486H01L2924/01029F21K9/00H01L33/62H01L2224/48091H05K1/0206H01L24/49H01L2224/49F21V29/83F21V29/85F21Y2115/10H01L24/48H01L2924/00014H01L2924/12041H01L2924/181H01L2924/00H01L2224/45099H01L2224/05599H01L2924/00012
Inventor 吕英杰江国丰赖志铭
Owner FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC