Test method of functional module chip in integrated circuit

Abstract

The invention relates to a test method of a functional module chip in an integrated circuit, which is characterized in that: an input signal wire needing to be protected and an output signal wire needing to be strengthened are found out, connecting objects of port are distinguished, and protecting measures are provided for the input port; and a filter capacitor and test electrical parameters are added to a power circuit, the power line and the important line are shielded and protected; distant configuration for an analog port and a digital port is conducted, and a circuit base plate is manufactured, and the circuit base plate is connected with test instruments; under the circumstances that the functional module chip is not used, the manufacturing and the connecting of the base plate are checked; the module chip is used to validate, the electric potential of the shielding and protecting line is adjusted, and the digital signal and the analog signal are divided; the testing is conductedunder normal temperature, limiting temperature, the functional module chip is judged whether meet the design requirements, and the data is used as reference during the development of the novel integrated circuit. Therefore, the anti-interference capacity of the functional module chip during testing can be increased.

Description

technical field [0001] The invention relates to a testing method, in particular to a testing method for a functional module chip in a circuit. Background technique [0002] With the rapid development of science and technology, the scale of integrated circuits is increasing day by day, the function integration is getting higher and higher, and the power consumption is getting lower and lower. At this time, the modular design method is widely used. For integrated circuits, design-time simulation can help designers design integrated circuits, but to accurately understand the actual performance of the designed product, it is necessary to test the finished integrated circuit to judge whether the module meets the design requirements. When testing the finished integrated circuit, it is only possible to judge whether the finished integrated circuit meets the design requirements, and it is impossible to find out which part of a specific functional module does not meet the design requ...

AI Technical Summary

Problems solved by technology

When testing under extreme conditions, the tested functional module chip needs to be tested under the condition of -40°C ~ 125°C, but the probes of common instruments cannot withstand such a harsh environment, which requires the signal line to be drawn out through the cable, and the At the same time, the interference signal of the external environment will be introduced into the test circuit due to the principle of electromagnetic induction.

Since the test object is only a functional module in an integrated circuit, its ability to suppress external interference signals is relatively weak and is easily damaged; some of its output ports are used in the design for other modules in the integrated circuit. As for the driving ability and anti-interference ability of these ports are relatively weak, the error between the detection data on the test equipment and the actual is relatively large

Due to the relatively low integration level of previous integrated circuits, relatively large power consumption and driving capability, the probability of the above-mentioned interference is relatively low, and the functional module chip that the test equipment can directly test can be added with anti-interference when interference occurs and cannot be tested. circuit

However, due to the improvement of integrated circuit integration, the reduction of power consumption and driving capability, the probability of the tested functional module chip being disturbed during the test process is getting higher and higher, and the traditional method cannot adapt

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