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Ink composition for forming organic insulator in roll printing method

A technology of ink composition and organic insulating film, which is applied in the direction of organic insulators, inks, plastic/resin/wax insulators, etc., can solve the problems of reduced efficiency, increased investment costs, and skyrocketing prices of high-resolution masks to achieve improved transparency. The effect of light rate

Inactive Publication Date: 2010-08-04
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In view of the current technical level, the situation of the photolithography process is that it is difficult to form fine patterns below 70nm on the substrate due to the interference of light
In addition, there are disadvantages in that the use of expensive equipment such as exposure equipment leads to an increase in initial investment costs and a skyrocketing price of high-resolution masks as patterns are advanced to reduce efficiency.
The actual situation is that there has not been an ink composition that can satisfy all the above characteristics before, and the development related to this has become an urgent demand

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] At room temperature, a) 3 parts by weight of urethane acrylate resin, b) 30 parts by weight of hydroxyethyl methacrylate, and c) 1,6-hexyl diacrylate having a polystyrene-equivalent weight average molecular weight (Mw) of 15,000 20 parts by weight of glycol ester, d) 42 parts by weight of propylene glycol methyl ether acetate, e) initiator "poly(polyoxyethylene 4,4'-azobis-(4-cyanovalerate))" 5 parts by weight were stirred for 12 hours or more to prepare an ink composition for roll printing.

Embodiment 2

[0037] At room temperature, a) 3 parts by weight of polyester acrylate resin, b) 30 parts by weight of glycidyl methacrylate, and c) 20 parts by weight of pentaerythritol triacrylate having a weight average molecular weight (Mw) of 15,000 in terms of polystyrene , d) 42 parts by weight of propylene glycol methyl ether acetate, e) 5 parts by weight of initiator "poly(polyethylene oxide 4,4'-azobis-(4-cyanovalerate)), and the surface 1 part by weight of the active agent was stirred for 12 hours or more to prepare an ink composition for roll printing.

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Abstract

The invention relates to an ink composition for forming organic insulator in roll printing method, provides an ink composition, which can improve the luminous transmittance, chemical resistance, shrinkage factor which will not cause deformation at high-temperature and high-pressure, cohesive force with various substrates and the like characteristics when the roll printing method is used to form the organic insulator of the electronic component. The ink composition is applied to thermal curing or light curing, and can improve the yield and process efficiency by increasing the precision of the film. According to the invention, the ink composition for forming organic insulator in roll printing method includes: a) 1-10 weight parts of acrylic copolymer resin; b) 5 to 55 weight parts of acrylic monomers; c) 0.9999 to 40 weight parts of crosslinking monomer with more than 2 double bonds; and d) 5 to 93 weight parts of organic solvent.

Description

technical field [0001] The present invention relates to an ink composition for forming an organic insulating film suitable for the roll printing method, and more particularly, to an ink composition for forming an organic insulating film suitable for the roll printing method, which is formed by the roll printing method. When used as an organic insulating film for electronic components, it can improve properties such as light transmittance, chemical resistance, shrinkage rate that does not cause deformation under high temperature and high pressure, and adhesion to various substrates. It is suitable for heat curing or light curing. Through Improve the precision of the film to improve the yield and improve the efficiency of the process. Background technique [0002] Generally, the process of forming fine patterns suitable for information storage, small sensors, optical crystals and optical elements, fine electromechanical elements, display elements, displays, and semiconductors ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/10C08F283/00C08F283/01H01B3/44C09D11/03H01B3/30
CPCB32B2457/00C09D11/02C09D11/101H01B3/44
Inventor 金炳厚申承协宋晙溶李骐范李命洙
Owner DONGJIN SEMICHEM CO LTD