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Processing method for cutting and forming rectangular infrared filter

A technology of infrared filter and processing method, applied in the direction of filter, metal processing, etc., to achieve the effect of reducing mechanical damage, operability processing cost, and simple equipment

Active Publication Date: 2010-08-04
SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a processing method for cutting and forming rectangular infrared filters, which overcomes and solves some problems and difficulties in the preparation of existing infrared filters, and satisfies the requirements of multi-band infrared detectors for small size and effective transmission. The size of the light range from the edge of the substrate requires strict requirements for infrared filters

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  • Processing method for cutting and forming rectangular infrared filter
  • Processing method for cutting and forming rectangular infrared filter

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Embodiment Construction

[0030] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings and examples: this example is a processing method for cutting and forming a rectangular infrared filter in a multi-band infrared detector assembly used in an aerospace project. The size of the infrared filter is required to be 3.5mm×1.5mm×0.2mm and the width of the filter edge without film is less than 20 microns. The processing and mounting parts of the rectangular infrared filter cut and formed are as attached figure 1 As shown, it is mainly composed of auxiliary molding silicon wafer 1, white wax 2 (model OCON-199, melting point 65°C), infrared filter base material 3, photoresist 4 (model AZ4620, positive photoresist), alignment line 5 composition. The main implementation steps of the processing method for cutting and forming a rectangular infrared filter are as follows:

[0031] 1) The selected infrared filter base material 3 is a...

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Abstract

The invention discloses a processing method for cutting and forming a rectangular infrared filter, which is applied to the technology of multi-band infrared detector integrated package. A main mounting piece structure for the processing method for cutting and forming the rectangular infrared filter comprises a base metal of the infrared filter, an auxiliary forming silicon chip, a photoresist, white wax, an aligned etched line. By introducing specific treatment methods in aspects of gluing protection of the infrared filter, etching the aligned etched line, cutting processing, washing out protective glue, and the like, and through a specific structure and operating steps, the processing method for cutting and forming the rectangular infrared filter is realized. Therefore, a small-dimension rectangular infrared filter which cannot be realized by the traditional processing methods can be obtained through processing, and mechanical damage and water pollution on a filter film system are effectively reduced.

Description

technical field [0001] The invention relates to optical element processing technology, in particular to a processing method for cutting and forming a rectangular infrared filter. Background technique [0002] High-performance multi-band infrared detectors are key components of aerospace and aviation remote sensing instruments. With the help of them, rich surface and atmospheric information can be obtained for resource exploration, weather forecasting, crop yield estimation, and environmental monitoring. In order to realize multi-band detection, improve the dynamic range and detection sensitivity of the detector, and suppress the infrared background radiation, in the multi-band infrared detector, multiple infrared filter sets with specific wavelength ranges will be installed before detecting the photosensitive element. With the development of integration and miniaturization of multi-band infrared detectors, the size of the infrared filters required is getting smaller and smal...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B5/20B26D1/547
Inventor 孙闻王小坤郝振贻俞君蔡子健赵水平
Owner SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI