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Method of manufacturing Opto-electric hybrid module

A technology of optoelectronic hybrid loading and manufacturing method, which is applied in the direction of electrical components, coupling of optical waveguides, printed circuit components, etc., to achieve the effects of high installation accuracy, improved optical coupling efficiency, and shortened distances

Active Publication Date: 2014-05-07
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the past, the optoelectronic hybrid module is configured by disposing between the optical elements 7, 8 and the optical waveguide part W1 The circuit portion E1 constituted by the substrate 15 and the circuit 14, whereby the distance between the optical elements 7, 8 and the end of the core 12 becomes longer, and the optical coupling efficiency between the two decreases

Method used

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  • Method of manufacturing Opto-electric hybrid module
  • Method of manufacturing Opto-electric hybrid module
  • Method of manufacturing Opto-electric hybrid module

Examples

Experimental program
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Embodiment

[0050] [Materials for forming the under cladding layer and the over cladding layer]

[0051] Through 35 parts by weight of bisphenoxyethanolfluorine glycidye ether (bisphenoxyethanolfluorine glycidye ether) (ingredient A), ester ring type epoxy resin 3', 4'-epoxycyclohexylmethyl-3,4-epoxy Cyclohexyl carboxylate (CELLOXIDE 2021P manufactured by DAICEL Chemical Industry Co., Ltd.) (component B) 40 parts by weight, (3',4'-epoxycyclohexane)methyl-3',4'-epoxycyclohexyl methyl Acetate (manufactured by DAICEL Chemical Industry Co., Ltd., CELLOXIDE 2081) (component C) 25 parts by weight, 4,4'-bis[bis(β-hydroxyethoxy)phenylsulfinyl]phenylsulfide-bis-hexa 2 parts by weight of a 50% by weight propioncarbonate (Japanese name: Propionka-Bonet) solution (component D) of fluoroantimonate was mixed to prepare materials for forming the lower cladding layer and the upper cladding layer.

[0052] [Formation material of core and bump positioning guide]

[0053] By adding the above component A: ...

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Abstract

An opto-electric hybrid module capable of achieving the reduction in distance between an optical element and a core end portion to improve the efficiency of light coupling therebetween, and a method of manufacturing the same are provided. The opto-electric hybrid module includes an optical waveguide section, an electric circuit section, and a light-emitting element (7) and a light-receiving element (8) both mounted on the electric circuit section. The optical waveguide section includes an under cladding layer (1), a linear core (2) for an optical path, the core being formed on a surface of the under cladding layer (1), and an over cladding layer (3) formed on the surface of the under cladding layer (1) and covering the core (2). An electric circuit (4) is formed on a surface portion of the under cladding layer (1) except where the core (2) is formed.

Description

technical field [0001] The present invention relates to a photoelectric hybrid module including an optical waveguide section, a circuit section, and an optical element mounted on the circuit section, and a manufacturing method thereof. Background technique [0002] For example, if Figure 8 As shown, the photoelectric hybrid assembly has the following structure: make the circuit part E 1 and the optical waveguide section W 1 , the circuit part E 1 The circuit 14 is formed on the front surface of the substrate 15, and the optical waveguide part W 1 The lower cladding layer 11, the core 12, and the upper cladding layer 13 are sequentially formed, and in this optical waveguide part W 1 The above-mentioned circuit part E is pasted with an adhesive 16 on the front side of the upper cladding layer 13 1 The back surface of the substrate 15, in connection with the above-mentioned optical waveguide part W 1 Both ends of the core 12 correspond to the above circuit part E 1 The...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/42
CPCG02B6/43H05K1/0274H05K2201/09036Y10T29/49124
Inventor 程野将行
Owner NITTO DENKO CORP
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