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Encapsulating device of organic photoelectronic device and encapsulating method thereof

A technology for optoelectronic devices and packaging devices, which is applied in the fields of electro-solid devices, photovoltaic power generation, electrical components, etc., can solve the problems of inaccurate control of pressure, and achieve the effects of precise packaging technology, easy operation, and simplified device packaging steps.

Inactive Publication Date: 2011-11-16
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The problem to be solved by the present invention is: how to provide a packaging device for an organic optoelectronic device and a packaging method thereof, the packaging device can solve the problem that the pressure caused by the conventional compaction method in the device packaging process cannot be accurately controlled, and ensure the packaging accuracy. Improve packaging efficiency, reduce equipment requirements and production costs, and have strong operability for substrate packaging of various sizes, better meet the needs of scientific research and production

Method used

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  • Encapsulating device of organic photoelectronic device and encapsulating method thereof
  • Encapsulating device of organic photoelectronic device and encapsulating method thereof
  • Encapsulating device of organic photoelectronic device and encapsulating method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0046] Such as Figure 4 The basic structure of the organic electroluminescent device (OLED) packaging system shown is that the device substrate is a glass substrate of 50mm×50mm, and the packaging cover plate is etched with soda-lime glass. The entire device structure is described as: glass substrate / ITO / NPB(50nm) / Alq 3 (30nm) / Mg:Ag(100nm).

[0047] The preparation method is as follows:

[0048] ①. Use acetone solution, deionized water and ethanol solution to ultrasonically clean the conductive substrate ITO glass, and dry it with dry nitrogen after cleaning. The ITO film on the glass substrate is used as the anode layer of the device, the square resistance of the ITO film is 12Ω / sq, and the film thickness is 180nm;

[0049] ②. Move the dried substrate into a vacuum chamber, and pretreat the ITO glass with low-energy oxygen plasma for 10 minutes under an oxygen pressure environment with an air pressure of 20Pa, and the sputtering power is 0-20W;

[0050] ③. Place the proc...

Embodiment 2

[0059] Such as Figure 5 The basic structure of the organic electroluminescent device (OLED) packaging system shown is that the device substrate is a glass substrate of 50mm×50mm, and the packaging cover plate is etched with soda-lime glass. The entire device structure is described as: glass substrate / ITO / CuPc(20nm) / α-NPD(60nm) / Alq 3 (40nm):C545T(2%) / Alq 3 (20nm) / Mg:Ag(100nm).

[0060] The preparation method is as follows:

[0061] ①. Use acetone solution, deionized water and ethanol solution to ultrasonically clean the conductive substrate ITO glass, and dry it with dry nitrogen after cleaning. The ITO film on the glass substrate is used as the anode layer of the device, the square resistance of the ITO film is 12Ω / sq, and the film thickness is 180nm;

[0062] ②. Move the dried substrate into a vacuum chamber, and pretreat the ITO glass with low-energy oxygen plasma for 10 minutes under an oxygen pressure environment with an air pressure of 20Pa, and the sputtering power ...

Embodiment 3

[0072] Such as Figure 4 The basic structure of the organic electroluminescent device (OLED) packaging system shown is that the device substrate is a glass substrate of 50mm×50mm, and the packaging cover plate is etched with soda-lime glass. The entire device structure is described as: glass substrate / ITO / PVK:PFC(100nm) / BCP(10nm) / Alq 3 (15nm) / Mg:Ag(100nm).

[0073] The preparation method is as follows:

[0074] ①. Use acetone solution, deionized water and ethanol solution to ultrasonically clean the conductive substrate ITO glass, and dry it with dry nitrogen after cleaning. The ITO film on the glass substrate is used as the anode layer of the device, the square resistance of the ITO film is 12Ω / sq, and the film thickness is 180nm;

[0075] ②. Move the dried substrate into a vacuum chamber, and pretreat the ITO glass with low-energy oxygen plasma for 10 minutes under an oxygen pressure environment with an air pressure of 20Pa, and the sputtering power is 0-20W;

[0076] ③....

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Abstract

The invention discloses an encapsulating device of an organic photoelectronic device, which is characterized by comprising a cover plate 1, a positioning plate 2, a compaction plate 4, a position chucking mechanism 7 and encapsulation compaction mechanisms 6, wherein the contact surface of the cover plate 1 with a substrate 3 is provided with a cover plate groove 3 adaptive to the substrate 3, the positioning plate 2 is provided with a positioning hole 9, the size of the positioning hole 9 is consistent to that of the substrate 3, the positioning hole 9 corresponds to the cover plate groove 8, the positioning plate 2 is arranged above the positioning hole 9, one side surface of the substrate 3, which is provided with an organic photoelectronic device functional layer, is led into the positioning hole 9 to the cover plate 1 and is matched with the cover plate groove 8 to work, the compaction plate 4 is arranged above the substrate 3, the position chucking mechanism 7 fixes the relativepositions of the cover plate 1, the positioning plate 2 and the compaction plate 4, the encapsulation compaction mechanisms 6 are respectively arranged above the compaction plate 4 and under the cover plate 1 correspondingly, and the substrate 3 and the cover plate 1 are uniformly and tightly combined via the pressure of the encapsulation compaction mechanisms 6.

Description

technical field [0001] The invention relates to the technical field of organic optoelectronics in electronic components, in particular to a packaging device for organic optoelectronic devices and a packaging method based on the device. Background technique [0002] Optoelectronics technology is a high-tech industry that develops rapidly after microelectronics technology. With the rapid development of optoelectronic technology, optoelectronic products such as solar cells, optical image sensors, plasma flat panel displays, electroluminescent displays, thin film transistors, and liquid crystal display panels have gradually matured, and they have greatly improved human life. At the same time, the wide application of optoelectronic information technology in various fields of social life has also created a huge growing market. Developed countries regard the optoelectronic information industry as one of the key development areas, and the competition in the optoelectronic informati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/00H01L51/40H01L51/48H01L51/56H10K99/00
CPCY02E10/549
Inventor 于军胜余双江蒋亚东马柱
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA