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Lithographic apparatus and device manufacturing method

A device, lithography projection technology, used in microlithography exposure equipment, optomechanical equipment, optics, etc., can solve problems such as lithography imaging performance degradation

Active Publication Date: 2014-07-16
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, air bubbles or droplets may cause, for example, deterioration of photolithography imaging performance

Method used

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  • Lithographic apparatus and device manufacturing method
  • Lithographic apparatus and device manufacturing method
  • Lithographic apparatus and device manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0059] figure 1 A lithographic apparatus according to an embodiment of the invention is schematically shown. The lithography equipment includes:

[0060] - an illumination system (illuminator) IL configured to condition a radiation beam B (eg, ultraviolet (UV) radiation or deep ultraviolet (DUV) radiation);

[0061] - a support structure (eg mask table) MT configured to support the patterning device (eg mask) MA and connected to first positioning means PM configured to precisely position the patterning device according to determined parameters;

[0062] - a substrate table (e.g. a wafer table or a substrate table) WT configured to hold a substrate (e.g. a resist-coated wafer) W and configured to precisely position the substrate according to determined parameters W's second positioning device PW is connected; and

[0063] A projection system (eg a refractive projection lens system) PS configured to project the pattern imparted to the radiation beam B by the patterning devic...

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PUM

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Abstract

The invention provides a photolithographic equipment and a device manufacturing method. In immersion lithographic apparatus, the formation of air bubbles in the immersion liquid is reduced or prevented by reducing the gap size or area area on the substrate table. The gap size is reduced using edge members, which may be rings such as the well known BES (Bubble Extraction System) rings. Information about the shape and / or cross-sectional dimensions (e.g., diameter) of the substrate, or about the size of the gap, is communicated to a controller controlling the edge member so that, desirably, the edge of the substrate is not squeezed , such as reducing the edge member to an appropriate size to minimize gaps. Alternatively or additionally, the gap may be reduced by moving the substrate and / or edge member adjacent the surface edge of the substrate table.

Description

technical field [0001] The present invention relates to a photolithographic equipment and a device manufacturing method, in particular to a method and equipment for positioning a device for exposure. Background technique [0002] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually a target portion of the substrate. For example, lithographic equipment may be used in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or reticle, may be used to generate the circuit pattern to be formed on the individual layers of the IC. The pattern can be transferred onto a target portion (eg, comprising a portion, one or more dies) on a substrate (eg, a silicon wafer). Typically, the pattern is transferred by imaging the pattern onto a layer of radiation sensitive material (resist) provided on the substrate. Typically, a single substrate will contain a network of adjacent target porti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/707G03F7/70341G03F7/2041G03F7/70483G03F7/70716
Inventor M·霍本
Owner ASML NETHERLANDS BV