Unlock instant, AI-driven research and patent intelligence for your innovation.

Substrate conveying device

A substrate conveying and conveying device technology, applied in the direction of electrical components, printed circuits, printed circuit manufacturing, etc., can solve problems such as resistance value reduction

Active Publication Date: 2010-09-15
NAGAOKA SEISAKUSHO
View PDF10 Cites 21 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of recent substrates for semiconductor devices that operate with minute power, the decrease in resistance value due to the adhesion of dust is particularly likely to become a problem.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate conveying device
  • Substrate conveying device
  • Substrate conveying device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. figure 1 The internal schematic structure of the apparatus which concerns on one Embodiment of this invention is shown in the state seen through from the front (transverse direction with respect to a conveyance direction). figure 2 Shown in the state seen from the side (upstream side of the conveying direction) figure 1 The schematic configuration of the interior of the device.

[0032] This apparatus 1 is an apparatus that has a function of removing dust from the surface of the substrate 100 being conveyed while conveying the substrate. In this example, this device 1 is referred to as a substrate transfer device. The board transfer device 1 is, for example, a board transfer device used in an assembly operation of a board 100 such as a printed wiring board. Typically, this device 1 is a substrate transfer device capable of removing dust from the upper surface 100 a ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a substrate conveying device, comprising: a conveying device (10) for conveying the substrate (100); a pair of rotary brush rollers (21,31) respectively arranged below and above the substrate (100) conveyed by the conveying device (10) and extending along the direction crossed with the conveying direction (A) of the substrate (100). The conveying device (10) comprises a first conveying device (11) for conveying the substrate (100) and arranged at the upper stream side of the rotary brush rollers; a second conveying device (12) for conveying the substrate (100) and arranged at the lower stream side of the rotary brush rollers. A clearance (13) for making the rotary brush rollers (21,31) contact with the substrate (100) is arranged between the first conveying device (11) and the second conveying device (12).

Description

technical field [0001] The present invention relates to an apparatus having a function of removing dust from the surface of the conveyed substrate while conveying the substrate. Background technique [0002] In the manufacturing process of substrates such as printed wiring boards, when dust such as solder residue or filings, dust, and dirt (trash, rubbish, dust) adheres to the surface of the substrate, it may become The main cause of problems such as the decrease in the resistance value of the part where dust is attached during the process of processing. In this case, the function of the substrate may be damaged. In the case of recent substrates for semiconductor devices that operate with minute power, a decrease in resistance value due to the adhesion of dust is particularly likely to become a problem. Therefore, in the assembly operation of such a substrate for a semiconductor device or the like, a step of removing dust adhering to the substrate is generally incorporated...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B08B1/04B08B7/04H05K3/00
Inventor 柳泽聪一
Owner NAGAOKA SEISAKUSHO