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Substrate conveying device

A technology of substrate conveying and conveying device, which is applied in the direction of electrical components, printed circuits, printed circuit manufacturing, etc., and can solve problems such as the reduction of resistance value

Active Publication Date: 2014-07-02
NAGAOKA SEISAKUSHO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of recent substrates for semiconductor devices that operate with minute power, the decrease in resistance value due to the adhesion of dust is particularly likely to become a problem.

Method used

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Examples

Experimental program
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Embodiment Construction

[0031] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. figure 1 The internal schematic structure of the apparatus which concerns on one Embodiment of this invention is shown in the state seen through from the front (transverse direction with respect to a conveyance direction). figure 2 Shown in the state seen from the side (upstream side of the conveying direction) figure 1 The schematic configuration of the interior of the device.

[0032] This apparatus 1 is an apparatus that has a function of removing dust from the surface of the substrate 100 being conveyed while conveying the substrate. In this example, this device 1 is referred to as a substrate transfer device. The board transfer device 1 is, for example, a board transfer device used in an assembly operation of a board 100 such as a printed wiring board. Typically, this device 1 is a substrate transfer device capable of removing dust from the upper surface 100 a ...

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PUM

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Abstract

The invention provides a substrate conveying device. The substrate conveying device (1) includes: a conveying device (10) for conveying a substrate (100); a pair of rotating brush rollers (21, 31), which are conveyed by the conveying device (10). The substrates (100) are arranged up and down, and extend in a direction intersecting the conveyance direction (A) of the substrates (100). The conveying device (10) includes: a first conveying device (11) for conveying the substrate (100), which is arranged on the upstream side of a pair of rotating brush rollers (21, 31); and a second conveying device (11) for conveying the substrate (100). A conveying device (12) is arranged on the downstream side of a pair of rotating brush rollers (21, 31). The first conveying device (11) and the second conveying device (12) are arranged with a gap (13) in which a pair of rotating brush rollers (21, 31) can contact the substrate (100).

Description

technical field [0001] The present invention relates to an apparatus having a function of removing dust from the surface of the conveyed substrate while conveying the substrate. Background technique [0002] In the manufacturing process of substrates such as printed wiring boards, when dust such as solder residue or filings, dust, and dirt (trash, rubbish, dust) adheres to the surface of the substrate, it may become The main cause of problems such as the decrease in the resistance value of the part where dust is attached during the process of processing. In this case, the function of the substrate may be damaged. In the case of recent substrates for semiconductor devices that operate with minute power, a decrease in resistance value due to the adhesion of dust is particularly likely to become a problem. Therefore, in the assembly operation of such a substrate for a semiconductor device or the like, a step of removing dust adhering to the substrate is generally incorporated...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B08B1/04B08B7/04H05K3/00B08B1/20
Inventor 柳泽聪一
Owner NAGAOKA SEISAKUSHO