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Air-cooling and liquid-cooling combined type heat radiating system

A heat dissipation system and combined technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of small temperature adjustment range, difficulty in meeting heat dissipation requirements, narrow application range, etc., achieve large temperature adjustment range, prolong service life, Wide range of effects

Inactive Publication Date: 2012-04-25
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional finned radiators mainly use air convection to dissipate heat, also known as air-cooled radiators. This type of radiator uses the heat dissipation area of ​​the fin itself and the airflow generated by the fan to take away heat. Although it has structure and control The method is simple, but the heat dissipation capacity is low; while the micro-channel liquid heat sink (cooler) uses liquid circulation to dissipate heat from electronic devices, etc., and the heat dissipation capacity is about 10 times higher than that of traditional air-cooled heat dissipation. However, the applicable temperature range of this type of radiator is narrow, and it is difficult to meet the heat dissipation requirements of electronic equipment in a complex temperature environment and a working environment with large temperature differences.
Therefore, the above-mentioned background technology has a single temperature adjustment function, a small temperature adjustment range, and a narrow application range, and it is difficult to meet the heat dissipation requirements of high-power electronic devices and electronic components, devices, and electronic equipment working in a complex temperature environment and a working environment with large temperature differences. Defects such as requirements

Method used

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  • Air-cooling and liquid-cooling combined type heat radiating system
  • Air-cooling and liquid-cooling combined type heat radiating system
  • Air-cooling and liquid-cooling combined type heat radiating system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Embodiment 1: Taking the heat dissipation system used on the space computer CPU (maximum power 100W) as an example, the fin-runner cold plate heat sink 1 is formed by integral precision casting of aluminum, on which there are 11 fins 1-1 in total Each piece (length×height) 100×80mm, the thickness of the connection between the lower part and the runner cold plate is 7.5mm, the thickness of the top is 2.5mm, and the total heat dissipation area is about 174480mm 2 , runner cold plate 1-2 (length×width×thickness) 100×100×8mm, runner (groove) 1-3 axial section (width×depth) 5×5mm, total length 620mm; substrate 2 (length×width× Thickness) 100×100×3mm, and the plane with the flow channel groove on the flow channel cold plate 1-2 is sealed and bonded together with silica gel, so that the flow channel groove located between the two becomes a seal with cooling liquid inlet and outlet Type flow channel: the controller 9 model is CJ1W-TC, which is equipped with 4 sensor information...

Embodiment 2

[0014] Embodiment 2: In this embodiment, the coolant channel groove is arranged on the substrate 2, and the substrate 2 (length×width×thickness) is 100×100×8mm, and the structure of the channel groove 2-1 on it is the same as that in embodiment 1. The flow channel (groove) 1-3 is the same, and the flow channel cold plate 1-2 in the fin-flow channel cold plate heat sink 1 is changed to (length×width×thickness) 100×100×5mm accordingly, and For a cold plate whose mating surface with the base plate 2 is flat (that is, without a runner groove), the arrangement and thermal area of ​​the upper fins 1-1 are the same as those in Embodiment 1; the structure, model, connection relationship and parameters of the other components The setting also all is identical with embodiment 1.

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Abstract

The invention belongs to a heat radiating system for electronic components and devices, electronic equipment, and the like, in particular to an air-cooling and liquid-cooling combined type heat radiating system. The air-cooling and liquid-cooling combined type heat radiating system comprises a heat radiating mechanism, a temperature sensor and a controller, wherein the heat radiating mechanism isprovided with an integral type fin-flow channel cold plate heat radiating assembly, a liquid cooler, a peristaltic pump, a liquid storing tank, a circulating pipe and a fan. Because the air cooling and the liquid cooling are combined into a whole, the sensor transmits the temperature information to the controller in real time, and the controller automatically starts the fan or / and the peristalticpump and automatically adjusts the rotating speed of the fan and the flow of the peristaltic pump according to the heating amount and the heat radiating requirement on the electronic device and the electronic equipment during working, the heat radiating system has large temperature adjusting range, wide application range, satisfaction of the heat radiating requirements on the large-power electronic device and the electronic device and equipment working in complicated temperature and the working environment with larger temperature difference change, guarantee of efficient, stable and safe working in lower temperature range, prolongation of service life, and the like.

Description

technical field [0001] The invention belongs to a combined heat dissipation system combining air cooling and liquid cooling. In the application of complex temperature environment, the heat dissipation system can adopt air cooling or liquid cooling alone according to the change of temperature environment and equipment working conditions. , Air cooling and liquid cooling can also be used for heat dissipation at the same time; this system can be widely used as a heat dissipation system for electronic equipment and high-power (including large power changes) electronic components and devices in complex temperature environments, such as aviation and spacecraft It is used in the heat dissipation system of electronic equipment and highly integrated electronic chips. Background technique [0002] With the development of electronic technology and aerospace industry, especially with the continuous improvement of integrated circuit integration, the operating speed and output power of va...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 徐尚龙胡广新李丽娟秦杰
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA