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Non-cyanide chemical gold plating solution and non-cyanide chemical gold plating method

A technology of chemical gold plating and plating solution, applied in liquid chemical plating, metal material coating process, coating and other directions, to achieve the effect of low cost, good economic and social benefits

Active Publication Date: 2012-09-05
信丰荣伟业科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A certain amount of cyanide-containing salts will be added to the additives of the original potassium gold cyanide gold plating solution as an antioxidant and stabilizer, which is no longer suitable for the cyanide-free gold plating process.

Method used

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  • Non-cyanide chemical gold plating solution and non-cyanide chemical gold plating method
  • Non-cyanide chemical gold plating solution and non-cyanide chemical gold plating method
  • Non-cyanide chemical gold plating solution and non-cyanide chemical gold plating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0050] The ratio of each main component is as follows:

[0051] Malic acid 7g / L,

[0052] EDTA 2 Na 5g / L,

[0053] Lactic acid 12g / L,

[0054] Ammonia 20g / L,

[0055] Anti-aging agent 3g / L,

[0056] Accelerator 0.5g / L,

[0057] Stabilizer 0.5g / L,

[0058] Potassium Gold Citrate 4g / L,

[0059] All the other contents are the same as in Example 1.

Embodiment 3

[0061] The ratio of each main component is as follows:

[0062] Malic acid 20g / L,

[0063] EDTA 2 Na 18g / L,

[0064] Lactic acid 35g / L,

[0065] Ammonia 45g / L,

[0066] Anti-aging agent 1g / L,

[0067] Accelerator 0.1g / L,

[0068] Stabilizer 0.1g / L,

[0069] Potassium Gold Citrate 1g / L,

[0070] All the other contents are the same as in Example 1.

Embodiment 4

[0072] The ratio of each main component is as follows:

[0073] Malic acid 12g / L,

[0074] EDTA 2 Na 12g / L,

[0075] Lactic acid 20g / L,

[0076] Ammonia 35g / L,

[0077] Anti-aging agent 1g / L,

[0078] Accelerator 0.3g / L,

[0079] Stabilizer 0.1g / L,

[0080] Potassium Gold Citrate 3.2g / L,

[0081] All the other contents are the same as in Example 1.

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Abstract

The invention discloses a non-cyanide electroless gold plating solution, which is prepared from the following components based on a concentration ratio: 7-20g / L of malic acid, 5-18g / L of EDTA2Na, 12-35g / L of lactic acid, 20-45g / L of ammonia water, 1-3g / L of antiager, 0.1-0.5g / L of accelerator, 0.1-0.5g / L of stabilizer and 1-4g / L of gold potassium citrate, wherein the pH value of the plating solution is 5.0-5.2. When the plating solution is used for gold plating, the temperature is 89-93 DEG C and the time is 7-30min. The invention utilizes a novel formula proportioning and takes non-cyanide salts as a stabilizer to realize the non-cyanide gold plating process of products like circuit boards and provide a novel non-polluted and low-cost path for gold plating process due to using no cyanide substances. The invention has good economic benefit and social benefit in the aspects of popularization and application.

Description

technical field [0001] The invention relates to a plating solution and a gold plating method of chemical gold plating, in particular to a plating solution and a gold plating method of cyanide-free chemical gold plating. Background technique [0002] With more attention to environmental protection and production costs, the traditional gold-plated main salt gold potassium cyanide gradually has a tendency to be replaced by cyanide-free gold salts, especially in recent years with the production of gold-potassium citrate-type cyanide-free gold salts and With the expansion of application scale, this trend becomes more obvious. Subsequently, gold plating additives also need to adapt to this cyanide-free requirement. A certain amount of cyanide-containing salts will be added to the additives of the original potassium gold cyanide gold plating solution as an antioxidant and stabilizer, which is not suitable for the cyanide-free gold plating process. [0003] In order to cope with ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/44C23C18/32
Inventor 梁继荣董振华
Owner 信丰荣伟业科技有限公司