Solar panel and encapsulation process
A solar cell panel and packaging technology, which is applied in the direction of circuits, photovoltaic power generation, electrical components, etc., can solve the problems of uneven packaging, high scrap rate, and bubbles, and achieve the effects of flat sealing, low scrap rate, and low hardness
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Embodiment 1
[0027] Such as figure 1 , figure 2 As shown, the present invention is a solar cell panel, comprising a silicon chip 2, the silicon chip is embedded in a layer of EVA glue layer 3, and through the EVA glue layer and the light-transmitting layer of the PCB board 4 and PET material respectively 1 phase bonding. The front, back, left, right, and lower sides of the silicon wafer are all set in the EVA adhesive layer, the thickness of the EVA adhesive layer is 0.3-0.5mm, and the upper side of the silicon wafer is attached to the lower side of the light-transmitting layer of the PET material. The positive and negative printed lines connected to the positive and negative electrodes of the silicon chip are arranged on the PCB.
[0028] The solar panel is manufactured by the following process, including the following steps:
[0029] The first step is to arrange the PCB board, sheet EVA hot melt adhesive, silicon wafer, sheet EVA hot melt adhesive, and the light-transmitting layer of...
Embodiment 2
[0036] Such as image 3As shown, the present invention is a solar cell panel, comprising a silicon chip 2, the silicon chip is embedded in a layer of EVA glue layer 3, and through the EVA glue layer and the light-transmitting layer of the PCB board 4 and PET material respectively 1 phase bonding. The front, back, left, right, and lower sides of the silicon wafer are all set in the EVA adhesive layer, the thickness of the EVA adhesive layer is 0.3-0.5mm, and the upper side of the silicon wafer is attached to the lower side of the light-transmitting layer of the PET material. The positive and negative printed lines connected to the positive and negative electrodes of the silicon chip are arranged on the PCB.
[0037] The solar panel is manufactured by the following process, including the following steps:
[0038] The first step is to arrange the PCB board, sheet EVA hot melt adhesive, silicon wafer, sheet EVA hot melt adhesive, and the light-transmitting layer of PET material ...
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