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Electronic element welding method and circuit board structure of circuit board

A technology of electronic components and soldering methods, which can be used in printed circuit components, electrical connection printed components, printed circuit assembly of electrical components, etc., and can solve problems such as lead-free solder solidification

Inactive Publication Date: 2010-12-22
INVENTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] The main purpose of the present invention is to provide a method for soldering electronic components of a circuit board and its circuit board structure, so as to solve the problem in the prior art that the lead-free solder has solidified before the electroplating through holes are filled.

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  • Electronic element welding method and circuit board structure of circuit board
  • Electronic element welding method and circuit board structure of circuit board
  • Electronic element welding method and circuit board structure of circuit board

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Embodiment Construction

[0034] see figure 1 and Figure 2A to Figure 2C The schematic diagrams shown are respectively a schematic diagram of the production process and a schematic diagram of the steps of an embodiment of the present invention.

[0035] Such as figure 1 and Figure 2A As shown, first a circuit board is provided, and at least one welding hole 15 and at least one heat collecting hole 16 are opened on the circuit board, and the heat collecting hole 16 is opened around the welding hole 15 to form a heat collecting area A (step 100).

[0036] Its circuit board has a board body 10, and is respectively provided with an upper surface 11 and a lower surface 12 on the opposite two sides of the board body 10, and is respectively provided with mutual stacking in the structure between the upper and lower surfaces 11, 12 of the board body 10. A plurality of circuit layers 13 and at least one ground layer 14 . The above-mentioned line layer 13 is composed of a plurality of power lines, which is...

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Abstract

The invention discloses an electronic element welding method and a circuit board structure of a circuit board. The electronic element welding method of a circuit board comprises the following steps of: firstly providing a circuit board, and arranging at least one welding hole and at least one heat collection hole on the circuit board, wherein the heat collection holes are arranged around the welding hole and form a heat collection area; then penetrating pins of the electronic element into the welding holes; then filling soldering tin into the welding holes through a welding process, and keeping the heat of the soldering tin in the heat collection area through the heat collection holes so as to ensure that the pins of the electronic element inside the welding hole are smoothly combined with the soldering tin.

Description

technical field [0001] The invention relates to a welding method for electronic components, in particular to a welding method for electronic components of a circuit board and a structure of the circuit board. Background technique [0002] At present, the wave soldering process mainly fills the plated through hole (PTH) on the printed circuit board with high-temperature liquid solder (solder), so that the electrons in the plated through hole (PTH) The pins of the components are combined with the printed circuit board to achieve the purpose of fixing the electronic components on the circuit board and electrically conducting them. [0003] The general wave soldering process roughly uses a turbulent wave to inject a high-temperature liquid solder from the bottom surface of the printed circuit board upward into the electroplating through hole, so that the solder fills the electroplating through hole and covers the connection of the electronic component. Solder joints are formed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34H05K1/18H05K1/11
Inventor 黄弘道吴仲扬
Owner INVENTEC CORP