Heat conduction type ethylene vinylacetate copolymer hot melt adhesive and preparation method thereof

A vinyl acetate copolymerization and hot-melt adhesive technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of reducing processing and injection molding performance, reducing the percolation threshold of heat-conducting network chains, etc. , to achieve the effect of reducing processing and injection molding performance, high thermal conductivity and prolonging service life

Inactive Publication Date: 2011-01-05
HANGZHOU NORMAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved in the present invention is to use at least two solid oxide powders of different particle sizes to fill the EVA hot melt adhesive, and to use the filling of small particles to large particle gaps in the blending process to reduce the percolati

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0015] Example 1

[0016] The solid oxide adopted in the embodiment is α-Al 2 o 3 , but the thermally conductive fillers applicable to the present invention are not limited to α-Al 2 o 3 .

[0017] 100 mass parts of EVA (vinyl acetate mass percentage content 28%, weight average molecular weight 7.6 × 10 4 , 70°C melt index 7.72) and 20 parts by mass of terpene resin, 0.6 parts by mass of [β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] pentaerythritol ester, 1.8 parts by mass of 2,5- Dimethyl-2,5-bis(tert-butylperoxy)hexane was heated and melted at 90°C in a mixer, and after stirring evenly, 90 parts by mass of pre-dried α-Al with a particle size of 4.7 μm was added 2 o 3 Powder and 90 parts by mass of α-Al with a particle size of 0.9 μm 2 o 3 Powder, blended for 30 min and discharged. EVA / Al with a thermal conductivity of 0.88 W / (m K) and a melt index of 6.31 at 70°C was obtained 2 o 3 Composite material, that is, thermally conductive EVA hot melt adhesive.

[0...

Example Embodiment

[0024] Example 2

[0025] Implementation method and steps are the same as in Example 1, changing two different particle sizes of α-Al 2 o 3 The number of parts by mass of the powder, that is, adding 126 parts by mass of α-Al with a particle size of 4.7 μm 2 o 3 powder and 54 parts by mass of α-Al with a particle size of 0.9 μm 2 o 3 powder to obtain a thermally conductive EVA hot melt adhesive with a thermal conductivity of 1.02 W / (m K) and a melt index of 6.01 at 70°C.

[0026]

Example Embodiment

[0027] Example 3

[0028] Implementation method and steps are the same as in Example 1, changing two different particle sizes of α-Al 2 o 3 The number of parts by mass of powder, that is, adding 144 parts by mass of α-Al with a particle size of 4.7 μm 2 o 3 powder and 36 parts by mass of α-Al with a particle size of 0.9 μm 2 o 3 powder to obtain a thermally conductive EVA hot melt adhesive with a thermal conductivity of 0.74 W / (m K) and a melt index of 5.41 at 70°C.

[0029]

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Abstract

The invention relates to a heat conduction type ethylene vinylacetate copolymer hot melt adhesive and a preparation method thereof. The technical problem to the solved in the invention is to overcome the two shortcomings in background technology. The provided hot melt adhesive has a high heat-conducting property without considerably reducing processing and injection module properties, and the coefficient of heat conductivity of the hot melt adhesive is as high as 1.0W/(m.k). The hot melt adhesive is prepared by smelting and blending ethylene vinylacetate copolymer, antioxygen, crosslinking agent and 10 to 75 mass percent of heating conduction filler, wherein the ethylene vinylacetate copolymer comprises 19 to 36 mass percent of vinyl acetate and the balance of ethylene, the weight-average molecular weight of the ethylene vinylacetate copolymer is 5,000 to 100,000, and the melt index of the ethylene vinylacetate copolymer at the temperature of 70 DEG C is 2.5 to 70.0; the heat conducting filler is solid oxide powder with a grain size of 0.5 to 50 mum, and preferably is alpha crystal aluminum oxide (Al2O3) powder; and the heat conducting filler consists of at least two kinds of powder particles of different grain sizes, and the diameter ratio of the small particles to the large particles is less than 0.741.

Description

technical field [0001] The invention relates to an organic adhesive, in particular to a heat-conductive ethylene-vinyl acetate copolymer hot melt adhesive and a preparation method thereof. Background technique [0002] Electronic equipment such as solar photovoltaic cells, rectifiers, calculators, etc., the heat emitted during use will damage electronic components, so it is necessary to dissipate the generated heat to prolong the service life of electronic components. A metal backplane or radiator is usually installed on the back of the electronic component for heat dissipation, and the electronic component and the backplane or radiator are connected by a sealing adhesive with high thermal conductivity. EVA hot-melt adhesive is solid at room temperature and melts when heated to a certain extent. Once cooled below the melting point, it quickly becomes solid again. It has fast curing, strong adhesion, and the adhesive layer has certain flexibility and hardness. The process is...

Claims

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Application Information

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IPC IPC(8): C09J123/08C09J11/04C09J9/00
Inventor 杨科芳来国桥邱化玉蒋剑雄倪勇
Owner HANGZHOU NORMAL UNIVERSITY
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