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Micro-electromechanical system microphone

A microphone and through-hole technology, applied in the field of microphones, can solve the problems of reduced sensitivity, complicated process, high production cost, etc., and achieve the effect of increasing strength and simple production process

Active Publication Date: 2011-01-05
GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, most of the designs of the above-mentioned patents are complicated in technology and high in production cost.
There is also a large hollow in the center of the back plate, because the center of the back plate is the most likely to generate vibration. This design can effectively avoid the vibration of the back plate, but now the size of MEMS microphones is getting larger and larger. The smaller the size, this design greatly reduces the effective relative area of ​​the diaphragm and the back plate, and still produces adverse effects such as reduced sensitivity.

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0048] See Figure 1-4 As shown, the MEMS microphone includes a square substrate 1. The substrate 1 is made of monocrystalline silicon material with a cylindrical through hole 1a in the center; a barrier layer 2 is provided on the substrate 1, and the barrier layer 2 is made of silicon oxide material. The barrier layer 2 and the through hole 1a are also provided with a through hole 2a with the same shape as the through hole 1a at the corresponding position; a circular back plate 3 is provided above the barrier layer 2, and the back plate 3 is made of polysilicon material, such as Figure 4 As shown, there is a connection point 3b on the outside of the back plate 3, and the back plate 3 is connected to the connection point 3b through a narrow connecting rib 3a. The connection point 3b is provided with a metal point 3c for connecting to an external circuit; An insulating isolation layer 4 is arranged above the layer 3, and the isolation layer 4 is made of silicon oxide material. In...

Embodiment 2

[0054] See Figure 5-8 As shown, compared with Embodiment 1, this embodiment has the following differences:

[0055] The through hole 1a adopts a square shape, and the corresponding through hole 2a of the barrier layer 2, the back electrode plate 3, and the diaphragm 5 are also set to be approximately square, so that the shapes and positions of the back electrode plate 3 and the diaphragm 5 are corresponding;

[0056] The connecting ribs 5a connected to the diaphragm 5 are spirally distributed on the four sides of the diaphragm 5. The connecting ribs 5a are connected to the connecting points 5b supported on the isolation layer 4, and one of the connecting points 5b is provided for connecting to the outside. Metal point 5c of the circuit;

[0057] The reinforcing portion 1b in the through hole 1a of the base layer 1 is a gear-like distribution protruding from the inner side wall of the base through hole.

[0058] Relying on the above design, during the manufacturing process of the dia...

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Abstract

A micro-electromechanical system (MEMS) microphone comprises a substrate, a back plate, an isolation layer and a diaphragm, wherein a circular or square through hole is formed in the center of the substrate to form the back cavity of the MEMS microphone; the back plate is on the substrate and extends to form a connection point connected with an external circuit; the isolation layer is on the backplate; and the edge of the diaphragm is fixed on the upper end of the isolation layer to suspend the diaphragm on the isolation layer, the diaphragm is provided with a connection point connected withthe external circuit; and the back plate and the diaphragm have the same shape of the through hole of the substrate. By adopting the design, the strength of the back plate layer of the MEMS microphone can be effectively increased, the vibration of the diaphragm layer can not affect the back plate layer; and the effective relative area between the diaphragm layer and the back plate layer can not be sacrificed.

Description

Technical field [0001] The present invention relates to a microphone, and more specifically to the structure of a MEMS microphone. Background technique [0002] In recent years, as the volume and performance of electronic products such as mobile phones and notebooks have continued to decrease, the volume of supporting electronic components has also been continuously reduced, and performance and consistency improved. In this context, MEMS microphones produced by MEMS (Micro Electro Mechanical System) technology are the representative products. [0003] Because the thickness of the back plate of the MEMS microphone is thin, it is easy to drive the back plate to vibrate when the diaphragm receives sound signals and vibrate. Therefore, the rigid back plate is a prerequisite for the MEMS microphone to have good frequency characteristics and low noise. At present, the methods that have been reported to improve the rigidity of the back plate include: [0004] Patent US6012335 uses a thick...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R1/00
Inventor 宋青林潘昕庞胜利隋鸿鹏
Owner GOERTEK MICROELECTRONICS CO LTD