Image pickup lens, image pickup lens and the manufacturing method of the two

Abstract

To realize an image pickup lens that can be applied to an image pickup module in which a solid-state image sensing device is used, that allows a reduction in manufacturing cost, and that easily maintains its desired resolving power, etc., the second lens has a surface facing the subject, and the surface includes a central portion sticking out toward the subject and a peripheral portion surrounding the central portion and sinking in toward the image surface. Further, the image pickup lens satisfies the mathematical expression 0.30<d1 / d<0.45, where d1 is the length of a segment between the center of that surface of the first lens which faces the subject and the center of that surface of the first lens which faces the image surface and d is the whole optical length of the image pickup lens.

Description

technical field [0001] The present invention relates to an imaging lens, an imaging module, a manufacturing method of the imaging lens, and a manufacturing method of the imaging module mounted on portable terminal equipment such as a digital camera, and particularly relates to an imaging module using a solid-state imaging element, and an imaging module applicable to the imaging module. Imaging lens and manufacturing method thereof. Background technique [0002] In recent years, various products using a solid-state imaging element as an imaging element have been developed for an imaging module mounted in a device such as a digital still camera or a digital video camera. The solid-state imaging device referred to here includes, for example, devices composed of CCD (Charge Coupled Device: Charge Coupled Device) and CMOS (Complementary Metal Oxide Semiconductor: Complementary Metal Oxide Semiconductor). By using a solid-state imaging element, it is possible to reduce the size a...

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Problems solved by technology

Therefore, the more the miniaturization and thinning of the imaging lens are required, the more it is required to manufacture a lens with decentering close to 0 μm, so the manufacturing difficulty becomes very high

[0016] In addition, although the lens disclosed in Patent Document 3 can maintain high resolution and is relatively simple to manufacture, it needs to bend the film constituting the image surface, so it is difficult to apply to a camera module using a CCD or CMOS imaging sensor, that is, Difficult to apply to camera modules using solid-state imaging elements

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