Beta ray detector based on silicon carbide triode
A triode and β-ray technology, which is applied in the field of microelectronics, can solve the problems of semiconductor radiation damage, increase the total volume of the detector, and unusability, and achieve the effects of improving performance stability, good anti-radiation performance, and large effective area
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Embodiment 1
[0025] Step 1, select the doping concentration as 1×10 18 cm -3 n-type highly doped SiC substrate, and the epitaxial doping concentration on the epitaxial surface of the substrate is 5×10 14 cm -3 The n-type low-doped epitaxial layer, such as image 3 a.
[0026] In step 2, epitaxially epitaxially layer a doping concentration of 1×10 above the n-type low-doped epitaxial layer 17 cm -3 , a p-type epitaxial layer with a thickness of 0.5 μm, such as image 3 b.
[0027] Step 3, deposit 1 μm thick SiO on the p-type epitaxial layer 2 as a barrier layer, and the SiO 2 Spin-coat photoresist on the barrier layer, and use a photolithography plate with a grid pattern for photolithography. The grid pattern consists of one horizontal grid and three vertical grids. The width of the vertical grid is 5 μm, and the vertical grid spacing is is 40 μm, the width H of the horizontal grid is twice the width h of the vertical grid, the length L of the horizontal grid is equal to the length...
Embodiment 2
[0033] In the first step, the doping concentration is selected to be 3×10 18 cm -3 n-type highly doped SiC substrate, and the epitaxial doping concentration on the epitaxial surface of the substrate is 1×10 15 cm -3 The n-type low-doped epitaxial layer, such as image 3 a.
[0034] In the second step, an epitaxial layer with a doping concentration of 3×10 is formed above the n-type low-doped epitaxial layer. 17 cm -3 , a p-type epitaxial layer with a thickness of 0.5 μm, such as image 3 b.
[0035] The third step is to deposit 1 μm thick SiO on the p-type epitaxial layer 2 as a barrier layer, and the SiO 2 Spin-coat photoresist on the barrier layer, and use a photolithography plate with a grid pattern for photolithography. The grid pattern consists of one horizontal grid and 10 vertical grids. The width of the vertical grid is 5 μm, and the vertical grid spacing is is 50 μm, the width H of the horizontal grid is 5 times of the width h of the vertical grid, the length...
Embodiment 3
[0041] Step a, select the doping concentration as 7×10 18 cm -3 n-type highly doped SiC substrate, and the epitaxial doping concentration on the epitaxial surface of the substrate is 5×10 15 cm -3 The n-type low-doped epitaxial layer, such as image 3 a.
[0042] In step b, an epitaxial layer with a doping concentration of 5×10 is formed above the n-type low-doped epitaxial layer. 17 cm -3 , a p-type epitaxial layer with a thickness of 0.5 μm, such as image 3 b.
[0043] Step c, deposit 1 μm thick SiO on the p-type epitaxial layer 2 as a barrier layer, and the SiO 2 Spin-coat photoresist on the barrier layer, and use a photolithography plate with a grid pattern for photolithography. The grid pattern consists of one horizontal grid and 50 vertical grids. The width of the vertical grid is 5 μm, and the vertical grid spacing is is 60 μm, the width H of the horizontal grid is 10 times the width h of the vertical grid, and the length L of the horizontal grid is 10 times t...
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