Photosensitive resin composition and layered object obtained therewith
A photosensitive resin layer and photosensitive resin technology, applied in photosensitive material processing, optics, opto-mechanical equipment, etc., can solve the problems of weak film resistance, easy peeling of the support layer, poor via hole cover, etc. The effect of good porosity and sufficient peel strength
Active Publication Date: 2012-10-31
ASAHI KASEI KK
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Problems solved by technology
[0009] As a method of improving the resolution, it can be roughly improved by making the dry film resist thinner, but there is a problem that the resistance of the film to physical external force becomes weak due to the spraying in the development process and the etching process, so that in the development process, the etching process, etc. The cured resist film becomes unable to protect via holes and via holes during the etching process (poor capping property)
[0012] In addition, when the photosensitive resin composition contains a large amount of these photopolymerizable unsaturated compounds having a plurality of (meth)acrylate groups, if the thickness of the photosensitive resin layer becomes thin, there is a problem that the support layer is easily peeled off unplanned. The problem
Method used
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[0128] In the following, the invention is illustrated based on non-limiting examples.
[0129] The preparation method of the evaluation sample of the Example and the comparative example, the evaluation method and evaluation result of the obtained sample are as follows.
[0130] 1) Preparation of samples for evaluation
[0131] The photosensitive resin laminates in Examples and Comparative Examples were produced as follows.
[0132]
[0133] Prepare the solution of the composition shown in the following Table 1 so that the solid content reaches 50% by mass, and fully stir and mix it, and place it on a 16 μm thick polyethylene terephthalate film (Mitsubishi Chemical Corporation) as a support film. On manufacture R340-G16), the photosensitive resin composition shown in Table 1 was uniformly apply|coated using the mixing coater, and it dried at 95 degreeC for 1 minute. The film thickness of the photosensitive resin layer after drying was 10 micrometers. Next, a 35-micrometer-...
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Abstract
A photosensitive-resin layered object is provided in which the photosensitive resin layer, even when having a thickness as small as 3-15 [mu]m, has satisfactory tenting properties. The layered object includes a supporting layer, which does not peel off unintentionally, i.e., has a satisfactory peel strength. A photosensitive resin composition is also provided which comprises the following: (a) 20-90 mass% alkali-soluble resin, (b) 5-75 mass% compound having a photopolymerizable unsaturated double bond, and (c) 0.1-20 mass% photopolymerization initiator. The composition is characterized in that the compound having a photopolymerizable unsaturated double bond (b) comprises a compound represented by the following general formula (I): (I) {wherein R1, R2, R3, and R4 each independently is H orCH3; R5's each independently is propyl or butyl; n1+n2+n3+n4 is an integer of 21-50; and m1+m2+m3+m4 is an integer of 0-19 (the remainder being omitted)}.
Description
technical field [0001] The present invention relates to a photosensitive resin composition developable by an alkaline aqueous solution, a photosensitive resin laminate in which a photosensitive resin layer formed of the photosensitive resin composition is laminated on a support layer, and a photosensitive resin laminate using the photosensitive resin composition. A method of forming a resist pattern on a substrate, and various uses of the resist pattern. More specifically, the present invention relates to a photosensitive resin composition capable of imparting a suitable resist pattern in the manufacture of printed wiring boards, flexible printed wiring boards, and lead frames for IC chip mounting (hereinafter , called lead frame) manufacturing, metal foil precision processing such as metal mask manufacturing, BGA (Ball Grid Array, ball grid array) or CSP (Chip Size Package, chip-scale package) semiconductor package manufacturing, and Manufacturing of tape carrier substrates ...
Claims
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IPC IPC(8): G03F7/027G03F7/004G03F7/40H05K3/06H05K3/18
CPCG03F7/027
Inventor 西本秀昭
Owner ASAHI KASEI KK