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Conductive resin composition

A technology of conductive resin and composition, applied in conductive adhesives, epoxy resin glue, conductive materials dispersed in non-conductive inorganic materials, etc. Cost and other issues, to achieve the effect of suppressing the deterioration of electrical conductivity

Active Publication Date: 2013-10-02
THREEBOND FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of gold plating and platinum plating, it is not suitable for reducing the cost of conductive resin compositions filled with conductive powder such as conductive adhesives
In addition, even if silver plating is used, if the silver plating layer becomes thin, the reliability will be extremely reduced
As disclosed in Patent Document 4, it is attempted to suppress the decrease in conductivity by designing the shape of the powder. However, in a conductive adhesive, there must be a resin layer between the primary particles or secondary particles of the powder, so even if the surface of the powder is only delicate Oxidation, as a cured product of the conductive adhesive, the conductivity deteriorates rapidly

Method used

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  • Conductive resin composition
  • Conductive resin composition
  • Conductive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～14

[0042] In order to prepare the conductive resin composition, the following components were prepared.

[0043] (a) epoxy compound

[0044] ・Bisphenol A type liquid epoxy resin: "jER827 (manufactured by Japan Electronics Co., Ltd.)" or

[0045] ・Rubber-modified epoxy resin: "KL-610 (manufactured by Kurare Co., Ltd.)"

[0046] (b) Anhydrides

[0047] ・A mixture of 3-methyl-hexahydrophthalic anhydride and 4-methyl-hexahydrophthalic anhydride: "HN-5500 (manufactured by Hitachi Chemical Industries, Ltd.)" or

[0048] A mixture of 3-methyl-1,2,3,6-tetrahydrophthalic anhydride and 4-methyl-1,2,3,6-tetrahydrophthalic anhydride: "HN-2200( Hitachi Chemical Industries, Ltd.)”

[0049] (c) Organometallic coordination compounds

[0050] ・Titanium tetraacetylacetonate: "Oluga Chitsukus TC-401 (manufactured by Matsumotofain Chemical Co., Ltd.)" or

[0051] ・Zirconium tetraacetylacetonate: "Orgachix ZC-150 (manufactured by Matsumotofain Chemical Co., Ltd.)"

[0052] (d) Nickel powder, s...

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Abstract

Disclosed is a conductive resin composition which can secure sufficient reliability in reliability test even when a low-cost conductive powder is used. The conductive resin composition can be suitably used for conductive adhesives and the like. The conductive resin composition contains the following components (A)-(D). Component (A): an epoxy resin Component (B): an acid anhydride Component (C): an organic metal complex containing titanium and / or zirconium Component (D): a nickel powder and / or a silver powder

Description

technical field [0001] The present invention relates to a thermosetting conductive resin composition using inexpensive nickel powder or silver-plated powder instead of expensive silver powder, and using an epoxy resin that can withstand reliability tests such as a moisture resistance test, a thermal cycle test, and a thermal shock test. . Background technique [0002] A conductive resin composition with a conductive powder of 70 to 95% by mass and a resin component of 15 to 30% by mass is generally called a conductive adhesive. Powder. When the conductive powder is expensive, the cost tends to increase and the added value tends to decrease, so nickel powder or various silver plating powders are sometimes used in order to reduce the cost. [0003] In recent years, while the demand for highly reliable automotive electronic components has increased, it has been required to improve the reliability of personal computers and mobile phones. The use of the above-mentioned conduct...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08G59/42C08K3/08C08K5/1515C08K5/1539C08K5/56C08K9/02C09J9/02C09J11/04C09J11/06C09J163/00H01B1/22
CPCH05K2203/121C08K5/1539H01B1/22C08K5/0091C08G59/42H05K3/321H05K2201/0218C09J9/02C09J163/00C08K3/08C08L2666/54
Inventor 铃木宏则真船仁志
Owner THREEBOND FINE CHEM CO LTD