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Assembly method and assembly device of damp in microphone

A technology for assembling a device and a microphone, applied in the field of microphones, can solve the problems of difficulty in guaranteeing consistency, low production efficiency, affecting the function of the microphone, etc., and achieves the effect of saving process time, good consistency and improving performance

Active Publication Date: 2014-03-26
湖南盈准科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional pasting damping on the copper ring is generally manually pasted individually, the production efficiency is low, and the consistency is difficult to guarantee, which affects the function of the microphone

Method used

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  • Assembly method and assembly device of damp in microphone
  • Assembly method and assembly device of damp in microphone
  • Assembly method and assembly device of damp in microphone

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Experimental program
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Effect test

Embodiment Construction

[0027] The assembling method and assembling device of the damping in the microphone will be further described in detail mainly in conjunction with the accompanying drawings and specific embodiments below.

[0028] Such as figure 1 The assembly method of the damping in the microphone shown in one embodiment is mainly used for pasting the damping in the microphone with a conductive ring, wherein the conductive ring can be a metal or metal with good conductivity such as a copper ring or an aluminum ring alloy ring etc. Specifically include the following steps:

[0029] Step S110 : providing full-page damping with an adhesive material on its surface.

[0030] Such as figure 2 As shown, an adhesive material (not shown in the figure) is provided on the surface of the full-page damper 210 , one side of the adhesive material is bonded to the full-page damper 210 , and the other side is bonded to the substrate 220 . The full-page damper 210 is a thin sheet made of damping material...

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Abstract

The invention relates to an assembly method of damp in a microphone, which is used for sticking the damp in the microphone provided with conducting rings. Through a punching technology, the whole damp is punched into a plurality of damp fit with the conducting rings, and the plurality of damp are simultaneously pasted on a plurality of conducting rings. The whole damp can be punched for one time to obtain the plurality of damp fit with the conducting rings in the mirophone, and simultaneously, the plurality of damp is pasted on the conducting rings one by one through a punching technology. Compared with the traditional single pasted by hand, the working procedure time is effectively saved, and efficiency is high; and the plurality of damp is simultaneously pasted on the corresponding conducting rings, so consistency is good, thereby effectively improving the property of the microphone. In addition, the invention further relates to an assembly device of the damp in the microphone.

Description

【Technical field】 [0001] The invention relates to the field of microphones, in particular to an assembly method and an assembly device for damping in a microphone. 【Background technique】 [0002] Electret microphones are usually stacked in sequence by dust-proof nets, casings, diaphragms, gaskets, back electrodes, cavities, copper rings, damping circuit boards, etc., and then packaged by edge-sealing technology. Among them, the damping is pasted on the copper ring. However, the traditional pasting of the damping on the copper ring is generally done manually, which is low in production efficiency and difficult to guarantee consistency, which affects the function of the microphone. 【Content of invention】 [0003] Based on this, it is necessary to provide a damping assembly method in a microphone with high production efficiency and good consistency. [0004] An assembly method for damping in a microphone, which is used for pasting damping in a microphone provided with a con...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R31/00
Inventor 权志学陈为波李剑徐俊峰
Owner 湖南盈准科技有限公司