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Mold for PLCC (plastic leaded chip carrier)

A mold and positioning pin technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as misprocessing and reverse placement of parts

Inactive Publication Date: 2011-04-27
吴江巨丰电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]When processing PLCC, because the previous positioning holes are left and right symmetrical, the operator is easy to put the parts upside down, resulting in misprocessing

Method used

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  • Mold for PLCC (plastic leaded chip carrier)
  • Mold for PLCC (plastic leaded chip carrier)
  • Mold for PLCC (plastic leaded chip carrier)

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0013] , Plastic chip carrier with leads, one of the surface mount packages, the shape is square, 32-pin package, the pins are drawn from the four sides of the package, and are T-shaped. It is a plastic product, and the size is much smaller than the DIP package. . The PLCC package is suitable for installing and wiring on the PCB with SMT surface mounting technology, and has the advantages of small size and high reliability.

[0014] When processing PLCC, positioning is usually used for PLCC positioning. Positioning pins are used to position the parts. Corresponding holes are usually opened on the upper and lower molds to obtain more precise positioning.

[0015] The present invention will be further described below in conjunction with the embodiments shown in the drawings:

[0016] A mold for PLCC, which includes PLCC4, upper mold 1, lower mold 2, and positioning pin 3 for positioning PLCC4. PLCC4 is provided with a first waist round through hole 5, which forms an isosceles rig...

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PUM

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Abstract

The invention discloses a mold for a PLCC (plastic leaded chip carrier), comprising the PLCC, an upper mold, a lower mold and a locating pin for locating the PLCC. The PLCC is provided with a first through hole, a first through hole group which forms a right angled isosceles triangle with the first through hole, and a second through hole group which forms a right angled un-isosceles triangle with the first through hole. The PLCC is located by the locating pin passing through the first through hole and the second through hole group. The lower mold and the upper mold are respectively provided with holes corresponding to the first through hole and the second through hole group. By utilizing the mold, the PLCC can be located fast and accurately, and the scrapping of the PLCC can be prevented simultaneously.

Description

technical field [0001] The invention relates to a mold, in particular to a mold for PLCC. Background technique [0002] It is a special pin chip package, which is a kind of patch package. The pins of this package are bent inward at the bottom of the chip and drawn out from the four sides of the package. They are T-shaped and are plastic products. Therefore, in the top view of the chip The pins of the chip are invisible, and it is now widely used in logic LSI, DLD and other circuits. [0003] When machining PLCC, due to the left-right symmetry of the previous positioning holes, it is easy for the operator to put the parts upside down, resulting in mis-processing. Contents of the invention [0004] In view of the above problems, the main purpose of the present invention is to provide a mold capable of quickly positioning PLCC. [0005] The technical scheme that the present invention adopts is: a kind of mold that PLCC is used, and it comprises PLCC, patrix, lower mold and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56
Inventor 沈国平
Owner 吴江巨丰电子有限公司