Seven-pin lead frame
A lead frame and frame technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of user loss and chip damage, and achieve the effect of simple structure and easy implementation
Inactive Publication Date: 2012-03-28
吴江巨丰电子有限公司
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Problems solved by technology
[0002] The demand for 7P chip packaging in the chip packaging industry requires a 7P lead frame to meet the various performance requirements of the package, such as attached figure 1 As shown, due to the potential difference between the sixth external pin and the eighth external pin, if the seventh external pin exists, it will cause an open circuit between the sixth external pin and the eighth external pin, and even damage the chip , causing losses to users
Method used
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[0013] The technical scheme of the present invention is described in detail below in conjunction with the embodiment shown in the accompanying drawings:
[0014] as attached figure 2 and attached image 3 As shown, the 7P lead frame of the present invention includes several frame units, each frame unit includes a base island and outer pins arranged around the base island, and the outer pins include a first outer pin 1, a second outer pin 2. The third outer pin 3, the fourth outer pin 4, the fifth outer pin 5, the sixth outer pin 6 and the eighth outer pin 8, and one side of the base island is provided with four lead areas 11, These four lead areas go counterclockwise around the base island one by one corresponding to the first outer pin 1, the second outer pin 2, the third outer pin 3 and the fourth outer pin 4, and the other side The fifth external pin 5, the sixth external pin 6 and the eighth external pin 8, one side of the base island is provided with the first external...
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The invention discloses a seven-pin lead frame, comprising a plurality of frame units which are provided with base islands and outer pins arranged at the peripheries of the base islands, wherein the outer pins comprises a first outer pin, a second outer pin, a third outer pin, a fourth outer pin, a fifth outer pin, a sixth outer pin and an eighth outer pin, the base islands comprise an upper baseisland and a lower base island which are mutually independent, the lower base island extends toward one side to form the fifth outer pin and the sixth outer pin, the upper base island extends toward the same side to form the eighth outer pin, the sixth outer pin and the eighth outer pin are connected by virtue of a third connecting rib, the upper base island is provided with a seventh outer pin which has the same extending direction of the eighth outer pin and is parallel to the eighth outer pin, and the fifth outer pin and the fourth outer pin, the sixth outer pin and the third outer pin, the eighth outer pin and the first outer pin as well as the seventh outer pin and the second outer pin are respectively oppositely distributed. When the seven-pin lead frame is in use, the seventh pin is removed, thus no short circuit is produced between the sixth outer pin and the eighth outer pin; and the lead frame has simple structure and is easy to implement, thus being applicable to popularization and application.
Description
technical field [0001] The invention relates to a lead frame, more specifically, to a 7P lead frame converted from an 8P lead frame. Background technique [0002] The demand for 7P chip packaging in the chip packaging industry requires a 7P lead frame to meet the various performance requirements of the package, such as attached figure 1 As shown, since there is a potential difference between the sixth outer pin and the eighth outer pin, if the seventh outer pin exists, it will cause an open circuit between the sixth outer pin and the eighth outer pin, and even damage the chip , causing losses to users. Contents of the invention [0003] The present invention provides a 7P lead frame obtained by improving the original seventh outer pin and the original eighth outer pin from 8P. [0004] In order to solve the problems of the technologies described above, the present invention adopts the following technical solutions: [0005] A 7P lead frame, including several frame units...
Claims
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IPC IPC(8): H01L23/495
CPCH01L2924/0002
Inventor 李军
Owner 吴江巨丰电子有限公司