Cooling structure of electronic equipment

Abstract

In an environment in which influence of heat energy from the outside is received, for example, when a large temperature difference occurs in an electronic equipment by external factors such as solar insolation or when a temperature difference occurs in the electronic equipment by heat of another device installed in the neighborhood, it is difficult to stabilize the temperature of the equipment within an allowable temperature range due to the influence of the external environment. An electronic equipment has a structure in which an electronic component contained in a housing is thermally connected to a housing inner wall through plural heat conduction members and a heat conduction control member, and the amount of heat transported from the electronic component to the housing inner wall is controlled by using the heat conduction control member. The amount of heat to be transported is decreased for a housing surface whose temperature rises by influence of the external environment, the amount of heat to be transported is increased for a housing surface which is not influenced by the external environment, and the temperature of the electronic component is stabilized within the allowable temperature range.

Description

technical field [0001] The present invention relates to the cooling structure of electronic equipment, especially, when the electronic equipment installed outdoors will cause a temperature difference in the electronic equipment due to external factors such as solar radiation or temperature difference in air temperature, as well as other devices installed nearby. The cooling structure of electronic equipment aims at reducing the influence of external heat energy and stabilizing the temperature of the equipment within the allowable temperature range when the heat causes a temperature difference in the electronic equipment. Background technique [0002] In recent years, with the increase in performance and density of electronic equipment, the treatment of heat generated from the equipment has become a major issue. In particular, in precision equipment, the permissible temperature range during operation is often limited, and matters related to heat treatment become strict condit...

AI Technical Summary

Problems solved by technology

[0014] Therefore, in the electronic device structure in which the heat absorbing portion of the heat pipe is connected to the electronic component, and the heat dissipation portion is connected to the inner wall of the housing, when the temperature of the inner wall (radiating portion) of the housing changes due to sunlight, the electronic component ( The temperature of the heat absorbing part) also changes passively, and it cannot be maintained at the specified temperature

[0015] In addition, since the heat pipe adopts a metal tube, the desired heat conduction efficiency cannot be obtained, and the heat energy from the external environment such as solar radiation is transported into the device, which is easily affected by external environmental factors such as solar radiation.

In other words, in the above-mentioned electronic device structure, it cannot be expected to greatly reduce the influence of external environmental factors

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