Wire arraying mechanism of wire winding drum of diamond wire cutting machine

A wire storage drum and diamond wire technology, applied in the field of wire storage drum wire arrangement mechanism, can solve the problems of poor single-layer wire arrangement accuracy, complex wire arrangement mechanism, unstable wire arrangement, etc. Simple wire structure and high stability

Active Publication Date: 2011-05-11
海宁市日进科技有限公司
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a wire storage cylinder wire-discharging mechanism of a diamond wire cutting machine, w

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  • Wire arraying mechanism of wire winding drum of diamond wire cutting machine
  • Wire arraying mechanism of wire winding drum of diamond wire cutting machine
  • Wire arraying mechanism of wire winding drum of diamond wire cutting machine

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[0014] The following describes the implementation of the present invention through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied in other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0015] See figure 1 and figure 2 , figure 1 Shown is a schematic diagram of the three-dimensional structure of the wire storage drum wire arrangement mechanism of the diamond wire cutting machine of the present invention. figure 2 Shown as a partial schematic diagram of the wire storage drum wire arrangement mechanism of the diamond wire cutting machine of the present invention. It should be noted that the diagrams provided in this embodiment...

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Abstract

The invention provides a wire arraying mechanism of a wire winding drum of a diamond wire cutting machine, which at least comprises a lifting rack, the wire winding drum fixed on the lifting rack, a mounting bracket relatively movably arranged on the lifting rack, a drive motor arranged on the lifting rack, a second change wheel and a screw rod, wherein the drive motor drives a drum shaft of the wire winding drum to rotate at high speed by a conveyor belt when working, simultaneously the drum shaft is decelerated for three times by a first change wheel, the second change wheel and a third change wheel to drive the screw rod to rotate at low speed, and the screw rod rotates to drive the lifting rack to slowly ascend or descend, thereby fulfilling the aim of single-layer wire arraying on the wire winding drum. The wire arraying mechanism of the wire winding drum provided by the invention is used for solving the problems of complexity, single-layer wire arraying inaccuracy and the like of the wire arraying mechanism in the prior art.

Description

technical field [0001] The invention relates to a multi-wire cutting technology, in particular to a wire storage drum wire-discharging mechanism of a diamond wire cutting machine. Background technique [0002] Multi-wire cutting technology is a relatively advanced silicon wafer processing technology in the world at present. Its principle is to use a high-speed moving steel wire to drive the cutting blade attached to the steel wire to rub against hard and brittle materials such as semiconductors to achieve cutting. Purpose. Compared with the traditional knife saw blade, grinding wheel and internal circle cutting, the wire cutting technology has the advantages of high efficiency, high production capacity and high precision. [0003] In the existing multi-wire cutting equipment, the steel wire is evenly wound on two cylindrical wire storage drums, that is, one is used for releasing the wire and the other is used for taking up the wire, and the steel wire passes through the wir...

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Application Information

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IPC IPC(8): B28D5/04
Inventor 卢建伟
Owner 海宁市日进科技有限公司
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