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Flex-rigid wiring board and method for manufacturing the same

A flexible circuit board, rigid-flex technology, used in printed circuit manufacturing, multi-layer circuit manufacturing, circuits, etc., can solve the problems of miniaturization and thinner electronic equipment that cannot be dealt with

Inactive Publication Date: 2011-06-22
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The device described in Patent Document 1 may not be able to cope with the situation that electronic devices (mobile phones, etc.) are smaller and thinner than before

Method used

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  • Flex-rigid wiring board and method for manufacturing the same
  • Flex-rigid wiring board and method for manufacturing the same
  • Flex-rigid wiring board and method for manufacturing the same

Examples

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Embodiment Construction

[0084] Next, a flex-rigid wiring board and its manufacturing method according to one embodiment of the present invention will be described.

[0085] Such as Figure 1A as well as Figure 1B As shown, the flex-rigid circuit board 10 of this embodiment roughly includes a first rigid substrate 11, a second rigid substrate 12, and a flexible substrate 13, and the first rigid substrate 11 and the second rigid substrate 12 face each other via the flexible substrate 13. ground configuration. In detail, the first rigid substrate 11 and the second rigid substrate 12 are arranged in the horizontal direction of the flexible substrate 13 .

[0086] Arbitrary circuit patterns are formed on the first rigid substrate 11 and the second rigid substrate 12 , respectively. Moreover, electronic components, such as a semiconductor chip, etc. are connected as needed. On the other hand, strip-shaped wiring patterns 13 a for connecting the circuit patterns of the first rigid substrate 11 and the c...

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Abstract

The invention provides a flex-rigid wiring board and method for manufacturing the same. The flex-rigid wiring board is provided with rigid substrates (11, 12) each having conductive sections, and a flexible substrate (13) having conductive sections. On a surface of the rigid substrate, a recessed section (300) is formed, and at least one of the conductive sections of the flexible substrate and at least one of the conductive sections of the rigid substrates are electrically connected to each other.

Description

technical field [0001] The present invention relates to a bendable rigid-flex circuit board partially composed of a flexible substrate and a manufacturing method thereof. Background technique [0002] Patent Document 1 discloses a flex-rigid circuit board including: a core substrate, which is a rigid part; a flexible substrate, which is arranged adjacent to the core substrate in the horizontal direction; a flexible adhesive layer laminated on the core substrate and the flexible substrate; a wiring pattern formed on the soft adhesive layer located in the rigid part; blind holes and / or through holes, the blind holes and / or through holes The holes connect the wiring patterns formed on the respective layers. [0003] Patent Document 1: Japanese Laid-Open Patent Publication No. 2006-140213 [0004] The device described in Patent Document 1 may not be able to cope with the reduction in size and thickness of electronic equipment (mobile phones, etc.) compared to the present. Co...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH01L2224/32225H01L2224/16225H01L2924/3025H01L2224/73204H05K2201/0715H05K2201/0187H05K3/4664H01L2224/48227H05K3/4691H05K2201/09509H05K1/0218H05K3/4602H05K3/4697H05K2201/09127H05K2201/09536H05K1/183H05K3/4652H05K2203/308H01L2224/0554H01L2224/05568H01L2224/05573H01L2924/00014Y10T29/49124Y10T29/49158H01L2924/00012H01L2924/00H01L2224/05599H01L2224/0555H01L2224/0556
Inventor 高桥通昌
Owner IBIDEN CO LTD
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