Method and device for manufacturing semi-circular thin line
A production method and thin circuit technology, which is applied in the field of semicircular thin circuit production devices, can solve the problems of broken or offset thin lines, brushing or sandblasting can not be accurately controlled, etc., to avoid broken lines or offset, Faster fading speed and better maintenance effect
Active Publication Date: 2012-10-03
NEW FOUNDER HLDG DEV LLC +1
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[0007] The embodiment of the present invention provides a semi-circular thin circuit manufacturing method, which is used to solve the problem in the prior art that the increased brushing or sandblasting after film fading cannot be accurately controlled, which may easily lead to disconnection or deviation of the generated thin circuit. shifting issues, the method includes:
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[0036] In order to solve the problem in the prior art that the brushing or sandblasting treatment added after etching cannot be accurately controlled, which may easily lead to disconnection or offset of the generated thin lines, the embodiment of the present invention provides a semicircular thin line production method, the specific processing flow is as follows figure 2 shown, including:
[0037] Step 201, exposing and developing the circuit board to which the coating layer has been added;
[0038] Step 202, etching the part displayed from the coating layer after exposure and development;
[0039] Step 203 , removing the coating layer, and performing micro-etching operation on the thin circuit formed after removing the coating layer to generate a semicircular thin circuit.
[0040] Such as figure 2 As shown in the process, when step 201 is implemented, there are many ways to increase the coating layer for the circuit board to be processed. For example, as mentioned in th...
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The invention discloses a method for manufacturing a semi-circular thin line. The method comprises the following steps: carrying out exposure and development on a circuit board in which a coating layer is added; etching parts which are subjected to exposure and development and then are displayed out of the coating layer; removing the coating layers which are subjected to exposure and development and then are not displayed out, and carrying out micro-etching operation on a fine line generated after removing the coating layers so as to generate the semi-circular thin line. The invention also discloses a device for manufacturing the semi-circular thin line. By using the method and device provided by the invention, the problems that milling or blast sanding treatment added after removing a film referred in the prior art can not be precisely controlled so as to easily cause that the generated fine line is broken or shifted can be solved.
Description
technical field [0001] The invention relates to the field of circuit board manufacturing methods, in particular to a semicircular thin circuit manufacturing method and a semicircular thin circuit manufacturing device. Background technique [0002] At present, the circuit board is developing more and more in the direction of precise and thin circuits. In the application, the denser the circuit, the heat dissipation function of the circuit surface needs to be strengthened. The shape of the cross-sectional area of the line made by acid etching or alkaline etching is trapezoidal or similar to that of a trapezoid. In theory, for lines of the same specification, the heat dissipation area of the semicircular line is 1.57 times that of the trapezoidal heat dissipation area. Therefore, in order to solve the problem that the heat dissipation function of the circuit surface needs to be strengthened, the existing technology proposes to make a semicircular thin circuit on the circuit...
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IPC IPC(8): H05K3/06
Inventor 麻建华
Owner NEW FOUNDER HLDG DEV LLC