Control method and system for COB (Chip on Board) glue sealing machine based on visual orientation technology

Abstract

The invention discloses a control method for COB (Chip on Board) glue sealing machine based on visual orientation technology, comprising the following steps: A. reading a standard drawing and analyzing the gray level distribution and angle point position of the standard drawing; B. reading images collected by a CCD (Charge Coupled Device); C. conducting similarity comparison on image collected by the CCD and the standard drawing; D. matching a glue applying template; and E. setting and driving a motion mechanism to an appointed position for glue applying. In the invention, a COB base plate is positioned by the CCD, so that the positioning precision is high; the base plate does not need to be fixed by a clamp, so that the cost is saved; the base plate is matched with the work procedure before the glue sealing, and an aluminum tray can be used directly, so that the work efficiency is improved; and the control command of a driving control unit is set, so that the glue applying work can be completed intelligently.

Description

technical field [0001] The invention relates to a COB sealing machine control technology, in particular to a COB sealing machine control method based on visual positioning technology and a system for realizing the method. Background technique [0002] The process of COB (Chip On Board, chip on board) sealing machine is first to cover the placement point of the silicon chip with thermally conductive epoxy resin (generally epoxy resin doped with silver particles) on the surface of the substrate, and then place the silicon chip directly on the surface of the substrate. The surface of the substrate is heat-treated until the silicon chip is firmly fixed on the substrate, and then the electrical connection is directly established between the silicon chip and the substrate by wire bonding. [0003] Most of the IC packaging parts on the circuit boards on a large number of production lines now have different sizes or multiple IC packaging parts. The sealing machine drives the sealing...

AI Technical Summary

Problems solved by technology

In the prior art, the COB substrate is fixed by a jig, and the glue sealing machine is used to dispense glue on the substrate. Since the sealing position of the COB substrate is uncertain, the sealing location is not accurate; and the sealing track of the COB substrate is not visualized. The operation can only be done by adjusting the position of the substrate manually, and the sealing track is difficult to control; the mechanical positioning is adopted, and the fixture used must have a complicated structure to fasten the COB substrate, which makes it difficult to manufacture the fixture, resulting in cost. In addition, for multiple IC sealing parts on one substrate or placing different substrates on a dispensing platform, flexible changes cannot be achieved, which reduces production efficiency

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