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Circuit element

A circuit component and component technology, applied in the field of circuit components, can solve the problems of component warping and bending

Inactive Publication Date: 2011-08-03
HITACHI MAXELL ENERGY LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, even if the element is manufactured with high precision by the manufacturing methods of the above-mentioned patent documents 1 to 3, the element will be warped or bent.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0043] according to figure 1 as well as figure 2 Embodiment 1 of the circuit element of the present invention will be described.

[0044] The circuit element 1 of this embodiment is an element used in the millimeter wave field. The first element 2 and the second element 3 constituting the circuit element 1 are produced by a printed circuit board forming process in a conventional method.

[0045] Outline processing. A photoresist is applied on a dielectric substrate on which a copper foil with a pattern of a circuit design is attached in advance, and then exposed. After exposure, the photoresist is developed to leave the resist on the circuit pattern, and the exposed copper is etched to form a pattern.

[0046] Etching is performed by iron oxide, but since the etching rate changes depending on the temperature of the etching solution, the concentration of the etching solution, and the etching time, stirring during etching and management of the etching solution are importan...

Embodiment approach 2

[0064] according to image 3 as well as Figure 4 Embodiment 2 of the circuit element of this invention is demonstrated.

[0065] The circuit element 100 of the present embodiment has substantially the same configuration as the circuit element 1 of the first embodiment described above, but the concave portion 11 of the second element 3 is omitted. Even in this case, the contact portions 9 are arranged such that the distance L between adjacent contact portions 9 is not more than 1 / 4 times λ without being affected by warping or bending of the dielectric substrates 4 and 6 . That is, the conductor 5 formed on the end surface of the protrusion 10 in the first element 2 contacts the conductor 7 of the second element 3 , and the length of the non-contact portion 8 can be shortened. Therefore, it is possible to eliminate the disadvantages caused by leakage of electromagnetic waves into the non-contact portion 8, and to achieve stable functions.

[0066] Incidentally, in this embod...

Embodiment approach 3

[0069] according to Figure 5 to Figure 8 Embodiment 3 of the circuit element of the present invention will be described.

[0070] The circuit element 110 of this embodiment is configured as a planar antenna used in the millimeter wave field, for example. The circuit elements 110, such as Figure 5 As shown, the first element 120 is a metal antenna adapter (the same symbol as the first element is given below), such as Figure 6 As shown, the second element 130 is a slot antenna (hereinafter assigned the same symbol as the second element). A fitting portion 121 into which the slot antenna 130 is fitted is formed on the antenna adapter 120 . Furthermore, an electromagnetic wave transmission line 122 for feeding power to the slot antenna 130 is formed on the antenna adapter 120 so as to be adjacent to the fitting portion 121 . The slot antenna 130 covers a resin-made dielectric substrate 140 with a conductor 150 and exposes a circuit pattern formed at a predetermined position....

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PUM

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Abstract

A circuit element (1) causes contact between a conductor (5) of a first element (2) and a conductor (7) of a second element (3) by superimposition of the first element (2) and the second element (3). A contacting section (9) is arranged such that the interval between that contacting section (9) and an adjacent contacting section (9) is no more than 1 / 4 times the propagation wavelength of electromagnetic waves. By means of this construction, stable function formation can be achieved by preventing problems caused by leakage of electromagnetic waves in the interval between adjacent contacting sections.

Description

technical field [0001] The present invention relates to a circuit element in which a plurality of elements are multilayered. Background technique [0002] High-frequency components require high-precision manufacturing technology as the wavelength used becomes shorter. In order to perform wireless transmission without compressing high-quality image transmission, the use of millimeter waves has been proposed, and the Wireless HD standard was roughly determined in January 2008 in IEEE802.15.3c as a global standard. [0003] As a background, in the millimeter wave field, specific low power that does not require wireless station licenses is allocated to the 60GHz band internationally, and preparations are in place for popularization and use in consumer use. [0004] Like millimeter waves, when the frequency increases, the wavelength becomes about 5 mm, and the structural size of the filter or antenna needs to be accurate in micron units. In particular, in an array antenna in wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P11/00H01L21/60H01P1/00
CPCH05K1/00H01L21/00H01Q21/064H01L2924/01029H05K1/0242H05K2201/09045H01P1/00H01Q21/0012H01L24/26
Inventor 饭田保
Owner HITACHI MAXELL ENERGY LTD