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Lighting module

A technology for lighting modules and lumens, applied in lighting devices, lighting and heating equipment, instruments, etc., can solve the problems of increasing the production cost of lighting modules

Inactive Publication Date: 2011-08-17
OSRAM SYLVANIA INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such limitations increase the production cost of lighting modules

Method used

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Examples

Experimental program
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example 1

[0063] In one example, a lighting module is provided with a plurality of rectangular LED chips (260 μm×450 μm) attached to a substrate. LED chips typically have a rated current of about 20mA and a forward voltage of about 3.2V. In operation, a forward current of 14mA (derating current) is delivered to the LED chip. As such, the input power per chip is about 0.064W. The design packing density for this example is approximately four chips per square inch. The plate temperature for such an example is approximately 56°C. Such examples also have the added advantage of increased chip efficiency due to driving the chip at lower currents, since the efficiency of the LED chip increases with decreasing current. For example, a 260μm × 450μm chip driven at a derated current of 14mA has an efficiency of about 30% (i.e., 30% of the input power is converted to light and the remaining 70% is heat), while at its rated current of 20mA The same chip driven was around 27% efficient. As such, ...

example 2

[0065] In another example, a lighting module is provided with a plurality of square LED chips (500 μm×500 μm) attached to a substrate. LED chips typically have a rated current of about 150mA and a forward voltage of about 3.2V. In operation, the chip is driven at a derated current of about 45mA. Such lighting modules are designed for a packing density of approximately one chip per square inch.

example 3

[0067] In another example, a lighting module is provided with 63 LED chip dies (equally spaced, ie nine rows of seven chips each) bonded to a printed circuit board. Then, reflector cups were placed around each chip and filled with phosphor-loaded silicone (ie, 1-2 weight percent phosphor). A shaped disc is then placed on top of the optical cup. The pad is designed to fit inside the cup but not touch the wire bonds or chip. In an alternative embodiment, two or more LED chips are provided within each cup.

[0068] Such lighting modules combine the thermal advantages of chip-on-board (COB) LED constructions with the enhanced light extraction of packaged discrete LED constructions to form 2D LED array lighting modules. Lighting modules are built with 2D arrays of chips die-bonded to a printed circuit board, with light cups, silicone, phosphor conversion, and optics built around the individual chips.

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Abstract

The invention provides a lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented.

Description

technical field [0001] The present invention relates to lighting modules. More specifically, the present invention relates to lighting modules comprising light emitting diode chips. Background technique [0002] Light emitting diodes (LEDs) are semiconductor devices that emit light when excited by electrical energy. Typically, an LED includes an LED chip disposed within a package. The LED chip is a semiconductor material (or combination of materials) impregnated or doped with impurities to create a p-n junction. When current is forward biased through the LED chip, electrons "jump" the p-n junction and emit light. The package is typically a plastic or ceramic material with electrical connections to couple the LED chip to the current source. The main disadvantage of LED packaging is that the thermal resistance of the package can be quite large (ie, greater than 100°C / W), which reduces the lifetime and performance of the LED chip. The terms "light emitting diode chip", "LE...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
CPCH01L25/0753H01L33/507G02F2001/133628F21Y2105/001F21K9/00G02F1/133603H01L2224/48091F21Y2101/02H01L33/60H01L2924/01322F21Y2105/10F21Y2115/10G02F1/133628H01L2924/00014H01L2924/00
Inventor D·汉比A·M·斯科奇J·塞尔弗里安
Owner OSRAM SYLVANIA INC