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Adhesive composition for producing semiconductor device, and adhesive sheet for producing semiconductor device

A technology of adhesives and compositions, which is applied in semiconductor/solid-state device manufacturing, adhesives, semiconductor devices, etc., can solve the problems that the effect of EG cannot be obtained, the effect of IG is reduced, and the effect of removing defects cannot be fully obtained.

Inactive Publication Date: 2011-09-21
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, as the thickness of wafers has become thinner in recent years, the effect of IG has become smaller, and the effect of EG cannot be obtained by removing the back surface strain caused by cracking or warping of the wafer, so there is a problem that the effect of removing defects cannot be obtained sufficiently.

Method used

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  • Adhesive composition for producing semiconductor device, and adhesive sheet for producing semiconductor device
  • Adhesive composition for producing semiconductor device, and adhesive sheet for producing semiconductor device
  • Adhesive composition for producing semiconductor device, and adhesive sheet for producing semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] The following (a) to (f) were dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 20% by weight.

[0076] (a) 30 parts of acrylate-based polymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Negami Industry Co., Ltd., Paraclon W-116.3)

[0077] (b) Epoxy resin (manufactured by JER Co., Ltd., Epicoat 1004) 5 parts

[0078] (c) 5 parts of phenolic resin (Milex XLC-LL manufactured by Mitsui Chemicals, Inc.)

[0079] (d) Multifunctional epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., Tetrorad-C)

[0080] 1 copy

[0081] (e) Silica filler (manufactured by Admatex Co., Ltd., SE-2050) 60 parts

[0082] (f) Nitrogen-containing compound (manufactured by Johoku Chemical Co., Ltd., benzotriazole compound, BT-120)

[0083] 0.5 parts

Embodiment 2

[0085] In Example 2, the adhesive composition solution of Example 2 was obtained in the same manner as in Example 1 above, except that the compounding amount of the nitrogen-containing compound in (f) was changed to 1 part.

Embodiment 3

[0087] In Example 3, the adhesive composition solution of Example 3 was obtained in the same manner as in Example 1 above, except that the compounding amount of the nitrogen-containing compound in (f) was changed to 3 parts.

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Abstract

Provided is an adhesive composition into which an additive for capturing a cation is incorporated, thereby making it possible to form a semiconductor-device-producing adhesive sheet capable of preventing deterioration of the electrical characteristic of a produced semiconductor device so as to improve the product reliability of the device. An adhesive composition, for producing a semiconductor device, which contains at least an additive for capturing a cation.

Description

technical field [0001] The present invention relates to an adhesive composition for semiconductor device manufacture and an adhesive sheet for semiconductor device manufacture. Background technique [0002] In recent years, stacked MCPs (Multi Chip Packages) in which memory package chips for portable audio equipment are laminated in multiple layers have become widespread. In addition, along with the multifunctionalization of image processing technology and mobile phones, etc., the higher density, higher integration, and thinner packaging have been promoted. [0003] On the other hand, in the semiconductor manufacturing process, cations (for example, copper ions, iron ions) are mixed into the crystalline substrate of the wafer from the outside, and when the cations reach the circuit formation surface formed on the wafer, there is a possibility that the electrical characteristics will deteriorate. question. In addition, cations are generated from circuits or metal wires duri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J11/00C09J11/04C09J11/06C09J7/00H01L21/68
CPCH01L24/29C08L63/00H01L2924/351H01L2924/181H01L2924/00C09J7/22C09J7/30C09J11/02C09J201/00H01L21/6836C09J2203/326H01L2221/68327C09J2301/30C09J2301/408
Inventor 木村雄大井上泰史松村健大西谦司宍户雄一郎
Owner NITTO DENKO CORP