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A package for an electrical device

A technology of electronic equipment and energy storage equipment, applied in the direction of capacitor shell/package, hybrid capacitor terminal, hybrid box/shell/package, etc., which can solve the problem of lack of robustness and safety, damage to the reliability and working life of supercapacitor components, etc. question

Inactive Publication Date: 2011-10-05
CAP XX LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, known packages tend to compromise the reliable performance and operating life of the supercapacitor element due to a lack of actual robustness and safety during manufacture and / or subsequent use

Method used

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  • A package for an electrical device
  • A package for an electrical device
  • A package for an electrical device

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0342] Example 1 - Forming a Hermetic LCP Package

[0343] Include 3850 and Alternating sheets of 3908 3 mm thick LCP laminate were machined into 28 x 20 x 3 mm open top shells with a continuous land around the opening. The internal dimensions of the housing are approximately 24 x 16 x 2 mm. Put two identical shells against each other so that the adjoining faces are aligned with each other, and then use the 50μm space between them 3908 layers, the two shells are heat-sealed together. The seal was created by heating the opposing shells to 290°C for 30 minutes, with spacers in heated jaws preventing excessive compression. The package thus formed was cooled to 80°C before removal from the heat sealer.

example 2

[0344] Example 2 - Forming a Hermetic LCP Package

[0345] Include 3850 and Alternating sheets of 3908 3 mm thick LCP laminate were machined into a 28 x 20 x 3 mm housing similar to Example 1 . But the abutment is bounded by an apex surrounding the top opening, wherein the apex is about 5 mm wide by about 1 mm thick. This provides a maximum external dimension of approximately 38x30x3mm. Put two identical shells facing each other, using the 50μm between them The 3908 layers are heat sealed together. The seal was created by heating the housing to 290° C. for 30 minutes, with spacers in heated jaws preventing excessive compression. The package thus formed was cooled to 80°C before removal from the heat sealer.

example 3

[0346] Hermeticity test of example 3-LCP package

[0347] A 0.5 mm diameter hole penetrating from the package body into the internal cavity was formed in the packages formed according to Examples 1 and 2 by drilling. The cavity is filled with approximately 0.7 ml of pure water or dry acetonitrile and the well is sealed by melting a small LCP plug. The filled packages were then tested for hermeticity by heating to 70° C. and measuring the weight loss after several weeks. No weight loss was measured, indicating that the resulting package has less than 1×10 -13 cm 3 .cm / cm 2 / s / Pa permeability, and for liquid acetonitrile, has less than 1×10 -10 cm 3 .cm / cm 2 / s permeability.

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Abstract

A supercapacitor (1) includes two like stacked supercapacitive cells (2, 3) that are connected to each other in series. A two-piece generally prismatic sealed package (4) defines an interior (5) to contain cells (2, 3). Package (4) includes a substantially planar access sidewall (6) having two spaced apart apertures (7, 8) extending from interior (5) to an exterior of the package. Sidewall (6) contains a liquid crystal polymer (LCP). A lead assembly, in the form of two spaced apart metal leads (9, 10) are electrically connected to cells (2, 3) respectively, and extend through respective apertures (7, 8) to allow external electrical connection to the cells.

Description

technical field [0001] The present invention relates to a package, and in particular to a package for electronic equipment. [0002] The present invention was developed mainly for supercapacitive devices and will be described below with reference to this application. It will be appreciated, however, that the present invention is not limited to this particular field of application, and may be used, for example, in other electronic devices, such as energy storage devices such as batteries and capacitors, as well as devices such as MEMS electronics, MEMS electromechanical devices, MEMS electronic Chemical devices, integrated circuit devices (ICs) and other electronic devices and any hybrids of the above, etc. Background technique [0003] Any discussion of prior art throughout this specification should not be construed as an admission that such prior art is widely known or forms part of the common general knowledge in the technical field. [0004] The use of liquid crystal po...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01M2/00H01M10/04H01M10/34H01G9/08H01M50/209
CPCH01G11/80H01M2/20Y02E60/13H01G11/58H01G11/82Y02E60/12H01G9/155H01M2/1094H01G9/08H01M2/1061H01G9/14H01G11/74H01G9/016Y02E60/10H01M50/209H01M50/24Y02P70/50
Inventor 菲利普·布雷特·艾奇森亚力山大·比利克艾伦·大卫·佩里安杰伊·库哈热夫斯基
Owner CAP XX LTD