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Tray for low-profile quad flat package (LQFP) integrated circuit

A technology of integrated circuits and pallets, applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve problems such as the inability to use automation equipment, and achieve the effect of simple structure

Active Publication Date: 2011-11-16
天水华天集成电路包装材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The trays disclosed in the patent "Trays for Semiconductor Integrated Circuit Devices" (patent number ZL00108111.X, announcement number CN1133571, announcement date 2004.01.07) are non-standard integrated circuit trays and cannot be used for automation equipment

Method used

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  • Tray for low-profile quad flat package (LQFP) integrated circuit
  • Tray for low-profile quad flat package (LQFP) integrated circuit
  • Tray for low-profile quad flat package (LQFP) integrated circuit

Examples

Experimental program
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Embodiment Construction

[0030] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0031] LQFP package integrated circuit outline structure, such as figure 1 , figure 2 and image 3 As shown, it includes an LQFP packaged integrated circuit body 1, a plurality of pins 2 are evenly distributed on the four sides of the LQFP packaged integrated circuit body 1, and upper side plastic packages are respectively arranged on the two end surfaces of the LQFP packaged integrated circuit body 1 3 and the lower plastic package 4; the upper plastic package 3 is provided with a circular first sinker 5 on the end surface, and the first sinker 5 is used to identify the first pin. During the processing, transportation and use of LQFP packaged integrated circuits, the four corners of the plastic package and the four corners near pin 2 are easily damaged, and special protection is required. In order to store and protect the LQFP packaged i...

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PUM

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Abstract

The invention discloses a tray for a low-profile quad flat package (LQFP) integrated circuit. The tray comprises a first frame and a flat plate, wherein the flat plate and the first frame form an upper frame body and a lower frame body; the upper frame body is internally provided with a plurality of first structural ribs and a plurality of second structural ribs; the first structural ribs and thesecond structural ribs are vertical to one another; the first structural ribs, the second structural ribs and the rim of the upper frame body encircle a plurality of storage containers; a base is arranged in each storage container, and a gap is reserved between the side face of the base and the inner wall of the corresponding storage container; the end faces of the bases are provided with segmental limiting ribs in a number the same as that of the side faces of the bases, and the segmental limiting ribs correspond to the side faces of the bases one to one; the segmental limiting ribs are shorter than the side edges of the bases; locators in a number the same as that of the bases are arranged in the lower frame body; and second limiting ribs are arranged on the end faces of spaced side walls of the locators respectively. The tray is simple in structure and easy to manufacture, and can prevent damage to the LQFP package integrated circuit during production and use and realize automatic operation.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit packaging and testing, and relates to a tray used in the process of packaging and testing integrated circuits, in particular to a tray used for LQFP packaging integrated circuits, so that LQFP integrated circuits are not affected during production and use. damage and can be automated. Background technique [0002] In integrated circuit related industries, in order to provide carrying tools, mechanical protection and anti-static protection for packaged integrated circuits during production, testing, transportation and use, and to realize standard mechanical automation operations, stackable trays are widely used . LQFP packaged integrated circuit trays have also matured. However, the thickness of the LQFP package body is generally 1.4mm, the distance between the integrated circuit pins of this package is very small (generally up to 0.4mm), and the pins are very thin and the number can r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/673
Inventor 马路平曾硕
Owner 天水华天集成电路包装材料有限公司
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