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Laminated high-frequency module

A high-frequency module, layered technology, applied in multilayer circuit manufacturing, crosstalk/noise/electromagnetic interference reduction (, printed circuit, etc.)

Inactive Publication Date: 2011-11-23
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, if the structure of the digital circuit part and the analog circuit part are not improved so that they do not interfere with each other electromagnetically, the characteristics of the high-frequency module will deteriorate

Method used

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  • Laminated high-frequency module
  • Laminated high-frequency module
  • Laminated high-frequency module

Examples

Experimental program
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Effect test

Embodiment Construction

[0043] A multilayer high-frequency module according to an embodiment of the present invention will be described with reference to the drawings. In addition, in this embodiment, a laminated high-frequency module that receives and transmits FM modulation communication signals, Bluetooth communication signals, and W-LAN communication signals is described as an example.

[0044] figure 1 It is a diagram showing the circuit configuration of the multilayer high-frequency module 10 according to the present embodiment. figure 2 It is a side cross-sectional view schematically showing the stacked structure of the stacked high-frequency module 10 according to the present embodiment. image 3 It is a group diagram showing plan views of each layer of the multilayer high-frequency module 10 according to the present embodiment.

[0045] The multilayer high-frequency module 10 has a digital circuit unit 200 including a baseband IC 21 and a front-end IC 22 as digital circuit ICs, and an ana...

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PUM

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Abstract

The invention aims to provide a laminated high-frequency module. The laminated high-frequency module comprises a digital circuit section and an analog circuit section, and can realize miniaturization with no bad influence to the environments. A laminate (100) includes a plurality of dielectric layers (101-118). In a lower layer region including some of the plurality of dielectric layers (101-103), a digital circuit is provided. In an interlayer (104-105) region including some of the plurality of dielectric layers, a digital circuit and an analog circuit are arranged so that they do not overlap in plan view of the laminate. In an upper layer region including some of the plurality of dielectric layers (116-118), a digital circuit is provided. Digital ICs are mounted on the surface of the uppermost dielectric layer in the upper layer region. An inner-layer ground electrode (401) is provided on substantially an entire boundary surface between the lower layer region and the interlayer region and on substantially an entire boundary surface between the interlayer region and the upper layer region. In the interlayer region, a digital line and an inner-layer ground electrode are alternately arranged in the lamination direction.

Description

technical field [0001] The present invention relates to a multilayer high-frequency module in which a high-frequency circuit having a predetermined function is integrated with a laminate and ICs mounted on the laminate. Background technique [0002] At present, high-frequency modules that can cope with various communication standards have been designed. In such a high-frequency module, digital ICs for Bluetooth (registered trademark) and W-LAN (Wireless LAN) are included. When using such a digital IC, the high-frequency module must include a digital circuit unit including the digital IC and an analog circuit unit including an RF processing unit such as a BPF (Band Pass Filter). At this time, unless the structures of the digital circuit unit and the analog circuit unit are improved so that they do not interfere electromagnetically with each other, the characteristics of the high-frequency module will deteriorate. [0003] Therefore, for example, in the high-frequency module...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/00H05K1/02H05K1/11
CPCH05K1/11H05K1/00H05K1/0218H05K2201/09336H05K3/4611H05K1/0298H05K2201/09327H05K1/02H05K3/46H05K2201/09972H05K1/0243H05K1/0219H05K2201/09618
Inventor 秋山贵宏
Owner MURATA MFG CO LTD