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Chip transmission device and location sensing system and visible checking system having chip transmission device

A transfer device and induction system technology, applied in the field of wafer transfer devices, can solve problems such as damaged wafers, wafer slippage, and reduced inspection process efficiency

Inactive Publication Date: 2014-01-29
HANMI SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] If the wafer conveyed by the automatic conveyer at high speed cannot be stably supported due to the wafer becoming very thin, wafer slippage occurs and the wafer may be damaged as a result
Also, failures during wafer transfer can reduce the efficiency of the inspection process

Method used

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  • Chip transmission device and location sensing system and visible checking system having chip transmission device
  • Chip transmission device and location sensing system and visible checking system having chip transmission device
  • Chip transmission device and location sensing system and visible checking system having chip transmission device

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Embodiment Construction

[0057] Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. The following detailed description of the embodiments includes specific details to provide a thorough understanding of the present invention and to fully provide perspective of the present invention to those skilled in the art. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.

[0058] figure 1 is an overview of the solar cell wafer inspection process. The solar cell wafer inspection process may include a visual inspection process performed by at least one visual inspection unit for inspecting residual contamination on the surface of the solar cell wafer or cracks at the wafer surface.

[0059] refer to figure 1 , the visual inspection unit 500 may include three visual inspection units. A first visual inspection unit 100 is provided to inspect r...

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PUM

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Abstract

PURPOSE: A wafer transfer device and a posting system having the same and a vision inspection system are provided to reduce the failure of a semiconductor and save costs by improving the reliability of a test result of the flatness of a wafer. CONSTITUTION: In a wafer transfer device and a posting system having the same and a vision inspection system, a wafer(W) is loaded in a transfer belt(1100) to be transferred. The transfer belt includes a first transfer belt and a second transfer belt. A pair of bet pulleys(1400) drives the transfer belt. A suction block(1500) applies a suction force to the internal side of the transfer belt. A light source radiates light to the side or bottom of a wafer which is transferred by the transfer belt.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2010-0048360 filed May 25, 2010, the contents of which are hereby incorporated by reference as if fully set forth herein. technical field [0002] The present invention relates to a wafer transfer device and a position sensing system and a visual inspection system having the same, and more particularly, to a wafer transfer device capable of stably transferring a wafer during inspection of a wafer to improve the reliability of total thickness variation measurement , and with its position sensing system and visual inspection system. Background technique [0003] A solar cell is a device that converts solar energy into electricity using semiconductor properties. A solar cell is configured to have a PN junction structure in which a positive (P) type semiconductor and a negative (N) type semiconductor are combined. When sunlight is incident on the solar cell, holes and electrons are generated in the s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/18H01L21/677H01L21/66G01S17/06
CPCY02P70/50B65G23/08B65G49/061B65G49/065G02F1/1303H01L21/67706H01L21/6838H01L22/12H01L22/30
Inventor 李暻植金昌显林裁瑛
Owner HANMI SEMICON CO LTD