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Chassis

A chassis and shell technology, which is applied in the direction of modification, instrument, cooling/ventilation/heating transformation using gaseous coolant, etc., can solve the problem of dust entering the chassis and affecting the heat dissipation effect, so as to improve the heat dissipation efficiency and prevent the entry of dust. Effect

Inactive Publication Date: 2011-12-07
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The case of many electronic devices will be equipped with cooling holes to dissipate heat for the heating elements inside the case, but if the opening of the cooling hole on the case is too large, a lot of dust will enter the inside of the case. If the opening is too small, it will affect the cooling effect

Method used

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Embodiment Construction

[0015] Please refer to figure 1 A preferred embodiment of the case 100 of the present invention includes a casing 10 and a plurality of heat dissipation holes 20 disposed on a heat dissipation area 12 of the casing 10 . The heat dissipation area 12 is generally arranged at a position corresponding to the heating element inside the housing 10 , and its shape and size can be designed according to needs. Here, a rectangular heat dissipation area 12 is used as an example for illustration.

[0016] The heat dissipation holes 20 on the heat dissipation area 12 are a number of circular openings evenly opened on the heat dissipation area 12, so that the heat dissipation area 12 forms a mesh structure as a whole. In other embodiments, the heat dissipation holes 20 can also be designed in other shapes . The material used in the heat dissipation area 12 is thermally inductive shape memory polymer material (shape memory polymer, SMP). Thermal inductivity means that the polymer can respon...

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Abstract

A case, comprising a housing and a plurality of heat dissipation holes arranged on a heat dissipation area of ​​the housing, the material of the heat dissipation area is thermal induction type shape memory polymer material, when the internal temperature of the housing is at When the temperature is below a preset temperature, the openings of the plurality of cooling holes change to a first size, and when the internal temperature of the housing is higher than the preset temperature, the openings of the plurality of cooling holes change to a second size. size, and the first size is smaller than the second size. The chassis can automatically adjust the opening size of the cooling holes according to the internal temperature of the chassis.

Description

technical field [0001] The invention relates to a cabinet. Background technique [0002] The case of many electronic devices will be equipped with cooling holes to dissipate heat for the heating elements inside the case, but if the opening of the cooling hole on the case is too large, a lot of dust will enter the inside of the case. If the opening is too small, it will affect the heat dissipation effect. Contents of the invention [0003] In view of the above, it is necessary to provide a chassis that can automatically adjust the opening size of the cooling holes according to the temperature inside the chassis. [0004] A case, comprising a housing and a plurality of heat dissipation holes arranged on a heat dissipation area of ​​the housing, the material of the heat dissipation area is thermal induction type shape memory polymer material, when the internal temperature of the housing is at When the temperature is below a preset temperature, the openings of the plurality ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H05K7/20
CPCG06F1/181H05K7/20127H05K7/20181H05K7/20209G06F1/20
Inventor 周艳丽
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD