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Flexible double-sided copper-clad board and manufacturing method thereof

A technology of flexible copper-clad laminates and manufacturing methods, which is applied in chemical instruments and methods, lamination auxiliary operations, synthetic resin layered products, etc., can solve the problems of large overall brittleness of copper-clad laminates and the inability to apply flexible copper-clad laminates, etc., and achieve The effect of improving productivity

Inactive Publication Date: 2013-11-13
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the field of hard copper-clad laminates, patent 200410051023.1 discloses a preparation method for high-performance polytetrafluoroethylene copper-clad laminates. Although a high-performance polytetrafluoroethylene copper-clad laminate with a dielectric constant of about 2.4 can be obtained, it still needs to use Reinforced with glass fiber cloth, it belongs to hard copper clad laminate and cannot be used in the field of flexible copper clad laminate
Patent 200910038586.X uses polytetrafluoroethylene as the filling material to prepare a high-frequency copper-clad laminate. Its dielectric constant can reach 2.0-2.2, which meets the needs of high-frequency and high-speed, but its main resin is phenolic resin and epoxy resin. Resin, the overall brittleness of copper clad laminates is very high, it still belongs to the field of hard copper clad laminates, and it cannot be applied to the field of flexible copper clad laminates

Method used

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  • Flexible double-sided copper-clad board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0045] Add 750g of NMP to a 1L three-necked flask, add 82.1g of BAPP to dissolve it, then place the solution in a water bath to cool, protect it with nitrogen, add 59.43g of BPDA after 30 minutes, and continue stirring at high speed for 3 hours to carry out polymerization reaction to obtain the viscosity 600mPa.s polyimide resin precursor solution. The polyimide resin precursor solution is a thermoplastic polyimide resin precursor solution.

Synthetic example 2

[0047] Add 440g NMP to a 1L three-necked flask, add 18.16g p-PDA to dissolve it, cool the solution in a water bath, add 49.42g of BPDA under nitrogen flow, then return the solution to room temperature, continue stirring for 3 hours, and carry out polymerization reaction to obtain a polyimide resin precursor solution with a viscosity of 1000 mPa.s. The polyimide resin precursor solution is a thermosetting polyimide resin precursor solution.

Embodiment 1

[0049] Pour the thermoplastic polyimide resin precursor solution obtained in Synthesis Example 1 into the dipping tank, make the porous polytetrafluoroethylene film with an apparent thickness of 12 μm pass through the dipping tank, and impregnate the polyimide resin on both sides Precursor solution is baked in the glue machine, the baking temperature is 220°C, the speed is 3m / s, and it is wound up. Cut the partially imidized adhesive sheet into a sheet-shaped adhesive sheet with the required size of 1m×1m, cover both sides of the adhesive sheet with 12μm electrolytic copper foil, and put it into a batch-type high-temperature hot press for pressing. combine. The lamination procedure is as follows: heat up to 250°C for 1 hour, hold at 250°C for 30 minutes, then heat up to 350°C for 1 hour, hold for 30 minutes, cool down to room temperature after 2 hours, and make a double-sided flexible copper clad laminate. Turn on the press Take out the double-sided flexible copper-clad lamin...

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Abstract

The invention relates to a flexible double-sided copper-clad board and a manufacturing method thereof. The flexible double-sided copper-clad board comprises a bonding sheet and copper foils laminated at two sides of the bonding sheet, wherein the bonding sheet comprises a porous polytetrafluoroethylene film and polyamideimide resin attached on the film through dipping and drying. The flexible double-sided copper-clad board is prepared by adopting the following steps of: effectively absorbing and dipping a polyamideimide resin precursor solution by adopting the flexible porous polytetrafluoroethylene film, drying, and pressing the copper foils so that the flexible double-sided copper-clad board is obtained. The flexible double-sided copper-clad board has high flexibility and low dielectric constant, is not only applicable to the field of common flexible printed circuit boards, but also applicable to the field of high-frequency high-speed flexible printed circuit boards with requirement on low dielectric constant. The flexible double-sided copper-clad board can be manufactured through one-step gum dipping, thus the production efficiency of flexible boards is greatly improved, and the manufactured copper-clad board has high flexibility and low dielectric constant (not higher than 2.8), and can be used in the field of flexible printed circuit boards with requirement on high frequency and high speed.

Description

technical field [0001] The invention relates to the field of flexible printed circuit boards, in particular to a low dielectric constant and highly flexible double-sided flexible copper clad laminate made of porous polytetrafluoroethylene film and polyimide resin and its production method. Background technique [0002] Flexible printed circuit boards have been widely used in consumer electronics products such as notebook computers, mobile phones, personal digital assistants, and digital cameras, which is driving consumer electronics products to become thinner, lighter and smaller. The emergence of iPhone and iPad has further promoted the large-scale application of flexible printed circuit boards. Moreover, with the development of 3G and 4G wireless communication technologies, higher requirements are placed on the high-frequency characteristics of printed circuit board substrates in electronic products. The dielectric constant of traditional flexible copper clad laminates i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B3/10B32B27/08B32B27/30B32B27/28B32B37/06B32B37/10B32B38/18
Inventor 苏民社张翔宇杨小进
Owner GUANGDONG SHENGYI SCI TECH