A kind of cleaning method of semiconductor silicon wafer
A semiconductor and silicon wafer technology, applied in the field of semiconductor wafer cleaning, can solve the problem of keeping the dielectric constant constant, and achieve the effect of reducing production costs and improving product performance
Active Publication Date: 2011-12-14
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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[0006] The technical problem to be solved by the present invention is to provide a method for cleaning semiconductor silicon wafers to solve the problem of how to effectively remove the photoresist while keeping the dielectric constant of the dielectric layer constant
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[0020] The method for cleaning semiconductor silicon wafers proposed by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in very simplified form and use imprecise ratios, which are only used for the purpose of conveniently and clearly assisting in describing the embodiments of the present invention.
[0021] The core idea of the present invention is to provide a semiconductor silicon wafer cleaning method, through the combination of degumming cleaning technology and supercritical fluid cleaning technology, the moisture remaining in the low dielectric constant dielectric material after degumming and cleaning can pass through the supercritical fluid The removal of critical fluid cleaning technology, using supercritical fluid to clean the ph...
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The invention provides a method for cleaning semiconductor silicon wafers, comprising the following steps: pretreating the silicon wafers so that the photoresist on the silicon wafers is in a state of easy peeling off; rinsing the silicon wafers to make the photoresist After rinsing, the silicon wafer from which the photoresist has been removed is kept clean and dry; the silicon wafer from which the photoresist has been removed is cleaned by supercritical fluid. The method for cleaning semiconductor silicon wafers provided by the present invention uses a supercritical fluid to clean the silicon wafers from which the photoresist has been removed, which can remove moisture in low dielectric constant materials and repair the raised dielectric constant, so that the semiconductor silicon wafers The cleaning method can be applied to the material interconnection process with low dielectric constant, which is helpful to improve product performance and reduce production cost.
Description
technical field [0001] The invention relates to the technical field of integrated circuit technology, in particular to a method for cleaning semiconductor silicon wafers. Background technique [0002] With the continuous improvement of integrated circuit manufacturing technology, the volume of semiconductor devices is becoming smaller and smaller, and very small particles have become enough to affect the manufacture and performance of semiconductor devices. Therefore, the silicon wafer cleaning process for removing tiny particles has become increasingly more and more important. [0003] Among all the cleaning steps, removing the photoresist after etching or stripping the photoresist after high-dose ion implantation is the most difficult step. Because the etching or implantation process will form a layer of carbonized hard shell on the surface of the photoresist, which is difficult to remove by conventional wet cleaning. A common method is to use oxygen plasma to treat the ...
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IPC IPC(8): H01L21/027B08B3/00
Inventor 张晨骋
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT