Lead frame and golden finger structure for Kelvin test sorting
A lead frame, Kelvin technology, applied in the direction of the measuring device shell, etc., can solve the problems of low test accuracy, inconsistent distributed capacitance, easy interference in testing and sorting, and achieve high test sorting accuracy, simple and compact structure, and test separation. Choose a convenient effect
Active Publication Date: 2011-12-21
WUXI HUIBO PUNA ELECTRONICS
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Problems solved by technology
However, it is easy to produce short circuit, virtual welding, inconsistent distributed capacitance and fracture during the welding process, which leads to easy interference of testing and sorting, low testing accuracy and short service life
Method used
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[0013] The present invention will be further described below in conjunction with specific drawings and embodiments.
[0014] Such as Figure 1~Figure 3 As shown: the present invention includes a front insulator 1, a rear insulator 2, a positioning installation insulator 3, a first Kelvin test piece 4, a second Kelvin test piece 5, a first lead frame 6, a second lead frame 7, and a base positioning installation area 8. Pin 9, bending 10, test sorting connection area 11, frame body connection hole 12, frame body 13, base insertion area 14 and installation groove 15.
[0015] Such as figure 1 Shown: In order to avoid the gold finger structure used in the existing Kelvin test sorting, when it is necessary to form the base socket area 14 by welding on the lead frame, it is easy to cause short circuit, virtual welding and inconsistent distributed capacitance. The lead frame includes the frame body 13 One end of the frame body 13 is set to form a test and sorting connection area 11...
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The invention relates to a wire frame and gold finger structure for Kelvin testing and sorting, which comprises a frame body. One end of the frame body is provided with a testing and sorting connection area, the other end of the frame body is provided with a base positioning and installation area, the base positioning and installation area and the testing and sorting connection area are provided with a plurality of pins, and the pins are distributed along the length direction of the axial line of the frame body. Since one end of the frame body is provided with the testing and sorting connection area, the other end of the frame body is provided with the base positioning and installation area, and the base positioning and installation area is integrated with the testing and sorting connection area, short circuits, cold joints and inconsistent capacitance distribution can be avoided during welding. The testing and sorting connection area is identical to the existing wire frame structure,and a base plugging area is formed on a positioned insulator through the base positioning and installation area and is connected with a HSOP type power integration circuit. The invention has the advantages of high testing and sorting accuracy, simple and compact structure, convenient testing and sorting, long service life, good applicability, low testing cost and high safety and reliability.
Description
technical field [0001] The invention relates to a lead frame and a gold finger structure, in particular to a lead frame and a gold finger structure for Kelvin test sorting, belonging to the technical field of integrated circuit testing. Background technique [0002] At present, the Kelvin testing and sorting consumables for HSOP (SOP (Small Outline Package) package with heat sink) power ICs with an outer lead distance of 0.03 inches are all dependent on imports, which are expensive, and the producing countries are still not The purpose of my country's implementation of this type of technical blockade is to continue to sell expensive consumables like them after the integrated circuit packaging and testing industry in my country uses their mainframes, resulting in an increase in the cost of testing and sorting. The existing Kelvin side sorting structure needs to form a base insertion area after welding the end of the lead frame, and then install the corresponding integrated cir...
Claims
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IPC IPC(8): G01R1/04
Inventor 殷友桃
Owner WUXI HUIBO PUNA ELECTRONICS