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curable resin composition

A technology of curable resins and compounds, applied in photosensitive materials for opto-mechanical equipment, coating of non-metallic protective layers, secondary processing of printed circuits, etc. Reduced reflectivity and other problems, to achieve low warpage, suppress the decrease in diffuse reflectance, and improve adhesion.

Inactive Publication Date: 2011-12-28
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the case of white solder resist, when the coating film is heated and cured, it may be discolored and colored, and the light reflectance may decrease.
Especially in the case of white solder resist, the commodity value decreases due to significant discoloration and decrease in reflectance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0093] Put 200g of dipropylene glycol monomethyl ether (hereinafter referred to as DPM) into a 500mL four-necked flask equipped with a stirrer, a thermometer, and a reflux tube. After raising the temperature to 100°C under a nitrogen atmosphere, add 35.0g (0.12mol ) caprolactone adduct of acrylic acid (equivalent to general formula (iii)) (average addition of 2 mol of caprolactone, "ARONIX M-5300" manufactured by Toagosei Co., Ltd.), 132.2 g (0.53 mol) of methacrylic acid Caprolactone adduct of 2-hydroxyethyl ester (equivalent to general formula (ii)) (1 mol of caprolactone added on average, "PLACCEL FM1D" manufactured by Daicel Chemical Industry Co., Ltd.), 60.1 g (0.60 mol) Methyl methacrylate ("LIGHT ESTER M" manufactured by Kyoeisha Chemical Co., Ltd.), and then 30 g of DPM and 0.6 g of dimethyl 2,2'-azo as a radical polymerization initiator were added dropwise over about 2 hours A mixed solution of bis(2-methylpropionate) ("V-601" manufactured by Wako Pure Chemical Indust...

Synthetic example 2

[0095] Put 200g of dipropylene glycol monomethyl ether (hereinafter referred to as DPM) into a 500mL four-necked flask equipped with a stirrer, a thermometer, and a reflux tube, and after raising the temperature to 120°C under a nitrogen atmosphere, add 18.1g (0.21 mol) methacrylic acid (equivalent to general formula (i)), 112.2g (0.45mol) caprolactone adduct of 2-hydroxyethyl methacrylate (equivalent to general formula (ii)) (average addition 1mol Caprolactone, "PLACCEL FM1D" manufactured by Daicel Chemical Industry Co., Ltd.), 92.8 g (0.45 mol) of phenoxyethyl methacrylate (equivalent to general formula (v)) (Sartomer Co., Ltd. ) "SR-340"), and then dropwise added 30 g of DPM and 1.9 g of dimethyl 2,2'-azobis(2-methylpropionate) (Wako Junyaku Co., Ltd. "V-601") mixed solution. Then, it stirred at 120 degreeC for 3 hours, and the DPM solution containing about 50 mass % of the copolymer resin which has a carboxyl group of the synthesis example 2 was obtained by this. The wei...

Synthetic example 3

[0097] 200g of dipropylene glycol monomethyl ether (hereinafter referred to as DPM) was dropped into a 500mL four-necked flask equipped with a stirrer, a thermometer, and a reflux tube, and after the temperature was raised to 120°C under a nitrogen atmosphere, 35.0g ( 0.12mol) caprolactone adduct of acrylic acid (equivalent to general formula (iii)) (average addition of 2mol caprolactone, Toagosei Co., Ltd. "ARONIX M-5300"), 99.7g (0.4mol) formazan Caprolactone adduct of 2-hydroxyethyl acrylate (equivalent to general formula (ii)) (average addition of 1 mol of caprolactone, "PLACCEL FM1D" manufactured by Daicel Chemical Industry Co., Ltd.), 92.8g (0.45 mol) phenoxyethyl methacrylate (equivalent to general formula (v)) ("SR-340" manufactured by Sartomer Co., Ltd.), 30g of DPM and 2.1g of DPM were added dropwise over about 1 hour for radical polymerization A mixed solution of dimethyl 2,2'-azobis(2-methylpropionate) (manufactured by Wako Pure Chemical Industries, Ltd. "V-601") a...

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Abstract

PROBLEM TO BE SOLVED: To provide a curable resin composition formable of a solder resist film having flexibility, low warpage, close adhesion with a substrate and chemical resistance, while preventing lowering of diffuse reflectance due to aging and thermal history.SOLUTION: This curable resin composition includes: (A) a carboxy group-containing copolymer resin; (B) a compound having a quaternary alkylphosphonium cation expressed by general formula (iv) (wherein R, R, Rand Rare the same or differentand are each 1-8C linear or branched alkyl or 3-8C monovalent alicyclic hydrocarbon optionally having hydroxy or 1-3C alkoxy as a substituent); (C) a compound having an epoxy group; and (D) an inorganic white pigment.

Description

technical field [0001] The present invention relates to a curable composition suitable for solder resists of printed wiring boards and flexible wiring boards, various resists, and the like. Background technique [0002] A printed circuit board is used to form a conductive circuit pattern on a substrate, and electronic components are mounted on the pads of the pattern by soldering, and the circuit portion excluding the pads is covered with a solder resist film as a permanent protective film. Thereby, when soldering electronic components on a printed circuit board, it prevents adhesion to parts that do not require soldering, and prevents circuit conductors from being directly exposed to air and corroding due to oxidation or humidity. [0003] For this reason, Patent Document 1 discloses a photosensitive resin composition useful as a one-component liquid photoresist, which has excellent stability, heat resistance, and chemical resistance, It can be developed with dilute alkali...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/42G03F7/004
CPCC08F220/26C08G59/22C08G59/68C08K3/013C08K5/50C08L33/068C08L33/14C08L63/00H05K3/28
Inventor 土屋雅裕喜多村明谷口裕亮原嶋启太
Owner TAMURA KK