Plating solution cooling device
A technology of cooling device and plating solution, which is applied to cells, electrolysis process, electrolysis components, etc., can solve the problems of large floor space, complicated pipeline and large energy consumption, and achieve the effect of compact structure and small floor space.
Active Publication Date: 2014-06-18
无锡出新环保设备有限公司
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Problems solved by technology
[0003] The invention provides a cooling device for plating solution, which can well solve the problems that the current industrially used cooling device occupies a large area, has complicated pipelines and consumes a lot of energy.
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[0012] like Figures 1 to 2 As shown, a specific embodiment of the present invention is provided. In the figure, the exhaust gas is drawn away from the groove surface, enters the air inlet 1, and then enters the first compartment 2 downwards. In the first compartment 2, upward jets are arranged. Shower pipe 3; then enter the second compartment 4 and the third compartment 5 in turn, and there are spray pipes 3 arranged facing the wind; the solution entering the spray pipe 3 is pumped from the central control tank and passed through the nozzle Atomization allows the small liquid droplets to fully contact with the airflow, greatly increasing the contact area, thereby increasing the cooling effect. The exhaust gas encounters the collision cap 8 upwards in the recovery liquid collection chamber 6 , and this structure causes the gas and liquid to be roughly separated here, where most of the small liquid droplets condense and drop into the recovery liquid collection chamber 6 . The ...
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The invention relates to a plating solution cooling device. The cooling device comprises an air inlet, cabins, a solution recovery and collection cabin, and an air outlet, wherein the cabins comprises a first cabin, a second cabin, and a third cabin, the three cabins are adjacent to the solution recovery and collection cabin, and the cabins and the solution recovery and collection cabin are sequentially arranged under the air inlet and the air outlet. The cooling device is characterized in that: the middle parts of the cabins are provided with spray tubes; the middle-upper part of the solution recovery and collection cabin is provided with driving caps; a packing layer is arranged over the driving caps, and the outside of the wall of the packing layer is provided with spraying and cleaning tube. By adopting a layer-progressive arrangement of the air inlet, the cabins, the solution recovery and collection cabin, and the air outlet, a space is effective utilized, so the cooling device which has a compacted structure occupies a small area.
Description
technical field [0001] The invention relates to a plating solution cooling device. Background technique [0002] At present, the cooling of the bath liquid in the electroplating tanks used in industry is achieved by the circulation of refrigerators, cooling towers, and heat exchangers in the tank to achieve cooling of the bath liquid. The exhaust system is also set up separately. Refrigerators and cooling towers, in this way, not only occupy a large area, have complicated pipelines, but also consume a lot of energy. Contents of the invention [0003] The invention provides a cooling device for plating solution, which can well solve the problems that the current industrially used cooling device occupies a large area, has complicated pipelines and consumes a lot of energy. [0004] In order to achieve the above purpose, the following technical solutions are adopted: [0005] A cooling device for plating solution, comprising an air inlet, a compartment, a recovery collectin...
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IPC IPC(8): C25D21/02
Inventor 胡诚岗
Owner 无锡出新环保设备有限公司