Pressure difference driving heat plate

Abstract

The invention provides a pressure difference driving heat plate, which comprises a body, wherein the body has a chamber; an evaporation part, a condensation part and a connection part are arranged in the chamber; the evaporation part is arranged in the chamber and has a plurality of first flow guide parts; the first flow guide parts are formed by distributing a plurality of first flow guide bodies at intervals; at least one first flow channel is formed between the plurality of first flow guide bodies; at least one end of the first flow channel is a free end and connected with a free region; the condensation part is arranged on the other side, opposite to one side on which the evaporation part is arranged, of the chamber; the condensation part has a plurality of second flow guide parts; the second flow guide parts are formed by distributing a plurality of second flow guide bodies; at least one second flow channel is formed between the plurality of second flow guide bodies; the connection part is arranged between the evaporation part and the condensation part and has at least one first communication hole group and at least one second communication hole group; the first communication hole group and the second communication hole group are communicated with the evaporation part and the condensation part; a low pressure end is generated on the condensation part by using appropriate pressure-reducing design; pressure gradient which is required by driving of vapor water cycle in the pressure difference driving heat plate is formed; and an operating fluid can be driven to transfer heat without any capillary structure.

Description

technical field [0001] The invention relates to a pressure difference driven hot plate, in particular to a pressure difference driven hot plate which can drive a working fluid to transfer heat without any capillary structure and greatly reduces manufacturing cost. Background technique [0002] In recent years, with the vigorous development of the electronic semiconductor industry, the progress of process technology, and under the trend of market demand, electronic equipment has gradually moved towards thinner and smaller shapes. It is unabated. For example, in the actual operation of notebook computers and desktop computers with the highest output value in the information industry, many electronic components generate heat, among which the CPU (Central Processing Unit) generates the most heat. The heat sink composed of the heat sink and the fan provides heat dissipation and plays an important role in protecting the CPU, keeping the CPU at a normal operating temperature to pe...

AI Technical Summary

Problems solved by technology

[0007] 1. Inconvenient processing;

[0008] 2. Unable to achieve thinning;

[0009] 3. High cost;

[0010]4. Time-consuming

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