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Light emitting device

A light-emitting device and light-emitting element technology, applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve the problems of high cost of equipment and molds, low reliability, high manufacturing cost, etc., achieve cheap manufacturing, improve reliability, and reduce failures Effect

Inactive Publication Date: 2012-02-01
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, due to the difference between the thermal expansion coefficient of the above-mentioned transparent epoxy resin 1004 and the thermal expansion coefficient of the black epoxy resin 1005, the transparent epoxy resin 1004 is easily peeled off.
[0009] Therefore, since the above-mentioned conventional light-emitting devices have many failures, there is a problem of low reliability.
[0010] also, Figure 14 The other conventional light-emitting devices shown use the transfer molding method to mold the transparent resin part 2004, so the cost of equipment and molds for obtaining the transparent resin part 2004 is relatively high
[0011] That is to say, there is the problem of high manufacturing cost in the above-mentioned other existing light-emitting devices

Method used

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Experimental program
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Effect test

no. 1 Embodiment approach

[0088] figure 1 A schematic cross-sectional view of the surface-mount light-emitting device 100 according to the first embodiment of the present invention is shown when it is cut in a plane perpendicular to the surface of the substrate 10 . also, figure 2 A schematic view of the above-mentioned surface mount type light-emitting device 100 viewed from above is shown.

[0089] The above-mentioned surface mount type light emitting device 100 such as figure 1 , figure 2 As shown, it includes: a substrate 10, a metal wiring pattern 20 provided on the substrate 10, a semiconductor light emitting element (semiconductor LED (light emitting diode) chip) 30 mounted on the substrate 10, and a dome-shaped semiconductor light emitting element 30 sealed. Phosphor sealing resin 40 , reflector 50 mounted on substrate 10 and having opening 51 overlapping semiconductor light emitting element 30 in plan view, and lyophobic layer 60 covering the inner wall surface of opening 51 of reflecto...

no. 2 Embodiment approach

[0122] Figure 5 A schematic cross-sectional view showing a surface-mounted light-emitting device 200 according to the second embodiment of the present invention cut on a plane perpendicular to the surface of the substrate 10 . also, Figure 6 A schematic diagram of the above-mentioned surface mount type light-emitting device 200 viewed from above is shown.

[0123] The above-mentioned surface mount type light emitting device 200 such as Figure 5 , Figure 6 As shown, a wiring pattern 220 and a dome-shaped phosphor-containing sealing resin 240 are provided. This wiring pattern 220 is different from the wiring pattern 20 of the first embodiment described above only in shape. In addition, the above-mentioned dome-shaped phosphor-containing sealing resin 240 is an example of the sealing resin of the present invention.

[0124] The lower portion of the dome-shaped phosphor-containing sealing resin 240 serves as a phosphor-containing layer 241 containing a phosphor (not shown...

no. 3 Embodiment approach

[0127] Figure 7 A schematic cross-sectional view showing a surface-mounted light-emitting device 300 according to the third embodiment of the present invention cut on a plane perpendicular to the surface of the substrate 10 . also, Figure 8 A schematic diagram of the above-mentioned surface mount type light-emitting device 300 viewed from above is shown.

[0128] The above-mentioned surface mount type light emitting device 300 includes a reflector 350 and a liquid repellent layer 360 .

[0129] The reflector 350 is mounted on the substrate 10 and has an opening 351 overlapping with the semiconductor light emitting element 30 in plan view. A stepped portion 352 is provided at the lower end portion of the inner wall of the opening portion 351 . The stepped portion 352 consists of a first cylindrical surface extending in the thickness direction of the substrate 10, an annular surface whose inner edge is connected to the upper end of the first cylindrical surface, and an oute...

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Abstract

The present invention provides a light emitting device which can be improved in reliability and moreover which can be manufactured with low cost. A surface-mount type light emitting device 100 includes a substrate 10, a interconnect pattern 20 provided on the substrate 10, a semiconductor light emitting element 30 mounted on the substrate 10 and electrically connected to the interconnect pattern 20, a dome-shaped phosphor-containing sealing resin 40 for sealing the semiconductor light emitting element 30, a reflector 50 attached to the substrate 10 and having an opening 51 which overlaps with the semiconductor light emitting element 30 in a plan view, and a liquid-repelling layer 60 which covers an inner wall surface of the opening 51 of the reflector 50 and part of which is in contact with the dome-shaped phosphor-containing sealing resin 40.

Description

technical field [0001] The present invention relates to a light-emitting device such as a surface-mounted light-emitting device in which a lyophobic coating material is applied to a package mounted on an LED (light-emitting diode), and particularly relates to a light-emitting device excellent in reliability and productivity. Background technique [0002] As a conventional light-emitting device, it is disclosed in JP-A-2002-223005 (Patent Document 1). The light emitting device such as Figure 13 It includes: a first wire 1001 , a second wire 1002 , a light emitting element 1003 mounted on one end of the first wire 1001 , and a transparent epoxy resin 1004 sealing the light emitting element 1003 . [0003] On the upper surface of the transparent epoxy resin 1004, a light emitting surface 1004a (convex lens) for emitting light emitted from the light emitting element 1003 is provided. [0004] One end of the second lead 1002 is electrically connected to the light emitting eleme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/00
CPCH01L2924/3025H01L2224/48247H01L33/60H01L2224/48091H01L2933/005H01L33/44H01L33/52H01L2924/00014H01L2924/00
Inventor 加藤正明
Owner SHARP KK