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Bonding head device

A bonding head and bonding part technology, applied in non-electric welding equipment, electrical components, circuits, etc., can solve the problems of bonding quality influence, inconvenient operation, complex movement form, etc., and achieve the effect of improving bonding quality

Inactive Publication Date: 2014-02-19
CETC BEIJING ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Compared with the bonding head on automatic pressure welding equipment, the bond head on manual and semi-automatic pressure welding equipment has a relatively complicated movement form. In addition to swinging motion, it also needs vertical movement. The bonding pressure of the bonding head is provided by the spring. During the bonding process, the operator adjusts the required bonding pressure by manually adjusting the expansion and contraction of the spring. This operation is inconvenient and imprecise, and has a negative effect on the bonding quality. influences

Method used

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Embodiment Construction

[0045] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0046] An embodiment of the present invention provides a bonding head device, which is applied to manual or semi-automatic pressure welding equipment. The bonding head device includes: a bonding head fixed frame; a sparking part, which is arranged on the bonding head fixed frame, It is used to complete the ignition; the wire feeding part is set on the bonding head fixed frame and is used to complete the wire feeding; the bonding part is set on the bonding head fixed frame, including: a voice coil motor for The bonding portion is provided with the bonding pressure required to complete the wire bonding.

[0047] figure 1 It is a structural schematic diagram of the striking part included in the bonding head device of the embodiment of th...

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Abstract

The invention provides a bonding head device, which is applied to manual or semiautomatic pressure welding equipment. The bonding head device comprises a bonding head fixed bracket, a fire striking part, a wire feeding part and a bonding part, wherein the fire striking part is arranged on the bonding head fixed bracket and is used for finishing fire striking; the wire feeding part is arranged on the bonding head fixed bracket and is used for finishing wire feeding; the bonding part is arranged on the bonding head fixed bracket; and the bonding part comprises a voice coil motor which is used for providing the bonding pressure required for bonding a lead for the bonding part. By using the technical scheme, the voice coil motor is used for providing the bonding pressure of a bonding head on the manual or semiautomatic pressure welding equipment, so that the bonding pressure can be accurately controlled in a programmed way and the bonding quality is improved.

Description

technical field [0001] The invention relates to the field of integrated circuit packaging equipment, in particular to a bonding head device applied to manual and semi-automatic pressure welding equipment. Background technique [0002] The pressure welding machine has two functions of ball welding and wedge welding, and can meet the needs of ordinary deep cavities, and is suitable for the production of substrates or cavity module components. With the rapid development of the microelectronics industry, various devices are facing the test of international circulation. The internal quality and appearance quality of components are becoming more and more important. development trend. The bonding head is the core component of the pressure welding machine, which integrates ignition, wire feeding, and pressure welding functions into one. Therefore, the research and development of the bonding head is particularly important. [0003] Compared with the bonding head on automatic press...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/603B23K20/10
CPCH01L24/78H01L2224/78H01L2924/00014H01L2924/14H01L2224/48H01L2924/00H01L2924/00012
Inventor 任绍彬纪伟姚爱民
Owner CETC BEIJING ELECTRONICS EQUIP