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Semiconductor device and method of manufacturing same

A semiconductor and resin packaging technology, used in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc. frame and other issues, to achieve the effect of achieving versatility, reducing the price of the frame, and increasing the degree of freedom

Inactive Publication Date: 2012-02-08
SEMICON COMPONENTS IND LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the types of semiconductor chips to be fixed on the heat sink are limited, and there is a problem that the lead frame does not have general versatility.
On the other hand, in order to fix semiconductor elements with various electrode patterns on the above-mentioned lead frame, it is necessary to connect thin metal wires in a three-dimensional crossing manner, and the ring top of the thin metal wires becomes high, which makes it difficult to cope with the thinning of the package. question

Method used

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  • Semiconductor device and method of manufacturing same
  • Semiconductor device and method of manufacturing same
  • Semiconductor device and method of manufacturing same

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Experimental program
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Embodiment Construction

[0043] Hereinafter, the semiconductor device according to the first embodiment of the present invention will be described. figure 1 (A) is a perspective view illustrating a semiconductor device. figure 1 (B) is figure 1 (A) A cross-sectional view of the semiconductor device taken along line A-A. figure 2 (A) is a plan view illustrating a heat sink used in a semiconductor device. figure 2 (B) is figure 2 (A) Cross-sectional view of the heat sink taken along line B-B. figure 2 (C) is figure 2 (A) Cross-sectional view of the heat sink taken along line C-C. image 3 (A) is a plan view illustrating the lead structure used in the semiconductor device. image 3 (B) and (C) are image 3 (A) A cross-sectional view taken along the line D-D of the lead wire structure.

[0044] First, if figure 1 As shown in (A), a plurality of leads 4 are led out from one side surface 3 of the resin package 2 of the semiconductor device 1 . On the other hand, U-shaped holes 7 for screw f...

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PUM

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Abstract

The invention provides a semiconductor device and a method of manufacturing the same. A conventional semiconductor device has a problem that a frame constituting a heat sink is expensive and the heat sink is highly likely to come off a resin package. The semiconductor device of the present invention reduces the frame price because a heat sink (9) is formed by subjecting a frame with a uniform thickness to pressing or something similar. Furthermore, the heat sink (9) is less likely to come off a resin package (2) because step regions (13 and 14) of the heat sink are pressed as connection regions to be connected to the other frame in which leads (4) are arranged, and thereby, resin constituting the resin package (2) goes around the step regions (13 and 14) and reaches up to back surfaces of the respective step regions. Moreover, a structure which makes the heat sink (9) much less likely to come off is realized because recessed portions (15 and 16) are arranged in the step regions (13 and 14) of the heat sink (9).

Description

technical field [0001] The present invention relates to a semiconductor device having a heat sink for heat dissipation and a method of manufacturing the same. Background technique [0002] As a conventional example, a structure in which two frames are connected and a manufacturing method thereof are known as follows. [0003] Figure 8 (A) is a top view explaining the frame on the side where the leads are arranged. The frame 61 is formed, for example, by pressing or etching a thin plate made of a copper-based material (copper or copper alloy). In the longitudinal direction of the frame (the X-axis direction on the paper surface), three mounting portions 62 indicated by dotted lines are arranged. Further, four through holes 63 are arranged around the three mounting portions 62 on the frame 61 . As shown in the figure, the mounting portion 62 is mainly composed of an opening 64 arranged in the central region, a plurality of lead wires 65 arranged around the opening 64 , and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/495H01L21/48H01L21/60
CPCH01L23/4334H01L24/29H01L24/45H01L24/48H01L24/49H01L2224/2919H01L2224/29339H01L2224/32245H01L2224/45144H01L2224/45147H01L2224/48091H01L2224/48247H01L2224/49111H01L2224/49113H01L2224/49171H01L2224/73265H01L2924/01014H01L2924/01079H01L2924/014H01L2924/01028H01L2924/01047H01L2924/07802H01L2924/181H01L2924/00014H01L2924/0665H01L2924/00H01L2924/00012H01L23/36H01L23/28
Inventor 都丸贤一
Owner SEMICON COMPONENTS IND LLC